SCHEMBL600572

SCHEMBL600572

CCC(C)(N)C(O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL364240 0.79
SCHEMBL24800075 0.79
SCHEMBL4473345 0.77
Alcohol SCHEMBL12814153 0.77 TSHR (0.33)
Water SCHEMBL1333595 0.77
SCHEMBL626961 0.75
SCHEMBL10892982 0.73 TSHR (0.36)
SCHEMBL277362 0.71
SCHEMBL15314520 0.71
SCHEMBL9003812 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4653506-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2025-11-26 EP claimed
WO-2025131704-A1 WATER-BASED HYDRAULIC FLUIDS CLARIANT INTERNATIONAL LTD (CH) 2025-06-26 WO claimed
EP-4263748-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF Fujifilm Electronic Materials U.S.A., Inc. (US) 2023-10-25 EP claimed
CN-114716916-A Chemical mechanical polishing composition and method of use thereof 富士胶片电子材料美国有限公司 2022-07-08 CN claimed
WO-2022140081-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-06-30 WO claimed
US-20220195242-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRIC MATERIALS U.S.A., INC. (US) 2022-06-23 US claimed
CN-112403528-A Odor-free fresh-keeping material, preparation method thereof and refrigerator 安徽康佳同创电器有限公司 2021-02-26 CN claimed
WO-2019187983-A1 POLYACETAL RESIN COMPOSITION ポリプラスチックス株式会社 2019-10-03 WO claimed
US-9713790-B2 Compound including oxalate, carbon dioxide absorbent including the same, method of preparing carbon dioxide absorbent and method of removing carbon dioxide KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2017-07-25 US claimed
US-20110214566-A1 CARBON DIOXIDE ABSORBENTS HYUNDAI MOTOR COMPANY (KR) 2011-09-08 US claimed
JP-2002541288-A 2002-12-03 JP claimed
US-20020019469-A1 Polyacetal resins with reduced formaldehyde odor E. I. DU PONT DE NEMOURS AND COMPANY 2002-02-14 US claimed
EP-1171519-A1 POLYACETAL RESINS WITH REDUCED FORMALDEHYDE ODOR E.I. DU PONT DE NEMOURS AND COMPANY (US) 2002-01-16 EP claimed
WO-2000059993-A1 POLYACETAL RESINS WITH REDUCED FORMALDEHYDE ODOR E.I. DU PONT DE NEMOURS AND COMPANY (US) 2000-10-12 WO claimed
EP-4653506-A1 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2025-11-26 EP disclosed
WO-2025131704-A1 WATER-BASED HYDRAULIC FLUIDS CLARIANT INTERNATIONAL LTD (CH) 2025-06-26 WO disclosed
US-20240199853-A1 SILICATE BASED THICKENER COMPOSITION BYK-CHEMIE GMBH (DE) 2024-06-20 US disclosed
US-4377678-A A CHAIN-EXTENDED, CROSSLINKED COPOLYMER OF A DIISOCYANATE AND A HYDROXYLATED POLYBUTADIENE; POLYURETHANES; POT LIFE NISSAN MOTOR COMPANY, LTD. (JP) 1983-03-22 US disclosed
EP-0020774-A1 POLYDIENE SERIES COMPOSITE BINDER FOR PROPELLANT NISSAN MOTOR CO., LTD. (JP) 1981-01-07 EP disclosed
US-4132687-A PAINT BINDERS VIANOVA KUNSTHARZ, A.G. (AT) 1979-01-02 US disclosed