⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL233186 | 0.72 | — | — | |
| SCHEMBL15015546 | 0.67 | — | — | |
| SCHEMBL15302285 | 0.67 | — | — | |
| SCHEMBL28798423 | 0.62 | — | — | |
| SCHEMBL37150 | 0.62 | — | — | |
| SCHEMBL21382086 | 0.62 | — | — | |
| SCHEMBL3424595 | 0.62 | — | — | |
| SCHEMBL119767 | 0.60 | — | — | |
| SCHEMBL1164694 | 0.60 | — | — | |
| SCHEMBL1079011 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110187604-A | Photosensitive polymer combination, dry film and printed wiring board | 互应化学工业株式会社 | 2019-08-30 | — | — | CN | disclosed |
| US-10162261-B2 | Negative photoresist composition for KrF laser for forming semiconductor patterns | YOUNG CHANG CHEMICAL CO., LTD (KR) | 2018-12-25 | — | — | US | disclosed |
| CN-108475015-A | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2018-08-31 | — | — | CN | disclosed |
| US-20180203351-A1 | NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER FOR FORMING SEMICONDUCTOR PATTERNS | YCCHEM CO., LTD. (KR) | 2018-07-19 | — | — | US | disclosed |
| US-8791221-B2 | Addition-curable metallosiloxane compound | DAICEL CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| EP-2650319-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | Daicel Corporation (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | DAICEL CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| CN-102047181-B | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2013-01-23 | — | — | CN | disclosed |
| CN-102047181-A | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2011-05-04 | — | — | CN | disclosed |
| EP-1723215-A2 | LIQUID CRYSTAL MATERIALS HAVING SILYL TAIL GROUPS | Displaytech, Inc. (US) | 2006-11-22 | — | — | EP | disclosed |
| US-20050189514-A1 | Liquid crystal materials having silyl tail groups | DISPLAYTECH, INC. | 2005-09-01 | — | — | US | disclosed |
| WO-2005077101-A2 | LIQUID CRYSTAL MATERIALS HAVING SILYL TAIL GROUPS | DISPLAYTECH, INC. (US) | 2005-08-25 | — | — | WO | disclosed |
| US-5938934-A | METAL ELEMENT OR COMPOUND ADSORBED BY DENDRIMER COMPRISING POLYAMINOAMIDE OR POLYPROPYLENIMINE HYDROPHILLIC CORE RADIALLY LAYERED WITH HYDROPHOBIC OUTER COATING OF CROSSLINKED ORGANOSILICON MATERIAL | DOW CORNING CORPORATION (US) | 1999-08-17 | — | — | US | disclosed |
| EP-0928813-A1 | Dendrimer-based nanoscopic sponges and metal composites | DOW CORNING CORPORATION (US) | 1999-07-14 | — | — | EP | disclosed |