⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL80196 | 0.95 | — | — | |
| Hydrochloric Acid SCHEMBL9733287 | 0.91 | — | — | |
| Ethylene SCHEMBL6726646 | 0.87 | — | — | |
| SCHEMBL9732038 | 0.84 | TSHR (0.36) | — | |
| SCHEMBL15581672 | 0.72 | — | — | |
| SCHEMBL20561697 | 0.72 | — | — | |
| SCHEMBL3082280 | 0.72 | — | — | |
| SCHEMBL6256655 | 0.70 | — | — | |
| Thiourea SCHEMBL10777311 | 0.68 | — | — | |
| SCHEMBL225778 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8114263-B2 | Provides additives allowing for reproducibly manufacturing particularly bright, i.e., mirror-polished, as well as well leveled and ductile copper coatings; allows for even the smallest holes in the surface of the workpiece to be filled; copper deposit is uniformly produced | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-02-14 | — | — | US | disclosed |
| US-20080210569-A1 | Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit | ATOTECH USA, LLC | 2008-09-04 | — | — | US | disclosed |