⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31325240 | 0.87 | — | — | |
| SCHEMBL31337151 | 0.87 | — | — | |
| SCHEMBL29451967 | 0.87 | — | — | |
| SCHEMBL1169745 | 0.87 | — | — | |
| SCHEMBL31325241 | 0.87 | — | — | |
| SCHEMBL3421246 | 0.87 | — | — | |
| SCHEMBL28751737 | 0.87 | — | — | |
| SCHEMBL25440124 | 0.82 | — | — | |
| SCHEMBL186436 | 0.82 | — | — | |
| SCHEMBL11658691 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026102972-A1 | PALLADIUM-PLATED/GOLD-PALLADIUM-PLATED COPPER BONDING WIRE WITH HIGH CORROSION RESISTANCE AND HIGH CONDUCTIVITY, AND PRODUCTION PROCESS THEREFOR | 上海万生合金材料有限公司 | 2026-05-21 | — | — | WO | claimed |
| CN-119855218-A | Packaging structure and packaging method of third-generation semiconductor chip | 华羿微电子股份有限公司 | 2025-04-18 | — | — | CN | claimed |
| CN-119465286-A | Electrocatalyst and application thereof in biomass alcohol end hydroxyl oxidation | 江苏大学 | 2025-02-18 | — | — | CN | claimed |
| CN-221427705-U | Chip fixing structure for gold-palladium-copper eutectic solder die bonding | 江苏芯丰集成电路有限公司 | 2024-07-26 | — | — | CN | claimed |
| CN-117506105-B | Preventive maintenance device for gold-palladium-copper eutectic welding upper control console | 江苏芯丰集成电路有限公司 | 2024-07-19 | — | — | CN | claimed |
| CN-221217944-U | Gold palladium copper bonding wire surface treatment device | 上海万生合金材料有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-117506105-A | Preventive maintenance device for gold-palladium-copper eutectic welding upper control console | 盐城芯丰微电子有限公司 | 2024-02-06 | — | — | CN | claimed |
| CN-116165255-A | Structure, preparation method and application mode of multipurpose hydrogen sensor | 深圳市鹏翔半导体有限公司 | 2023-05-26 | — | — | CN | claimed |
| CN-115966551-A | Semiconductor structure and forming method thereof | 中芯国际集成电路制造(上海)有限公司 | 2023-04-14 | — | — | CN | claimed |
| CN-113213258-A | Winding device for gold-palladium-copper bonding wire processing and working method thereof | 深圳中宝新材科技有限公司 | 2021-08-06 | — | — | CN | claimed |
| CN-109411773-A | A kind of palladium copper-golden nanometer thorn-like elctro-catalyst and preparation method thereof | 浙江工业大学 | 2019-03-01 | — | — | CN | claimed |
| CN-122105177-A | Iridium-element-reinforced palladium-gold-copper alloy and preparation method and application thereof | — | 2026-05-29 | — | — | CN | disclosed |
| CN-122105177-A | Iridium-element-reinforced palladium-gold-copper alloy and preparation method and application thereof | — | 2026-05-29 | — | — | CN | disclosed |
| CN-121548330-A | Packaging structure and packaging method of semiconductor power module | 华羿微电子股份有限公司 | 2026-02-17 | — | — | CN | disclosed |
| US-20260021453-A1 | SELECTION METHOD AND SYSTEM FOR TARGET PALLADIUM MEMBRANE, EXECUTION METHOD AND SYSTEM FOR HYDROGEN-RELATED REACTION, AND DETERMINATION METHOD AND SYSTEM FOR PERMEATION RATE | CHINA PETROLEUM & CHEM CORP (CN) | 2026-01-22 | — | — | US | disclosed |
| CN-110444774-B | Alloy nano cage catalyst and preparation method and application thereof | 中国科学院深圳先进技术研究院 | 2022-09-23 | — | — | CN | disclosed |
| CN-114147386-A | Copper sulfide resistant soldering paste capable of being sintered and connected at low temperature and preparation method thereof | 北京清连科技有限公司 | 2022-03-08 | — | — | CN | disclosed |
| CN-113725188-A | Bonding wire for packaging memory chip and preparation method thereof | 北京达博有色金属焊料有限责任公司 | 2021-11-30 | — | — | CN | disclosed |
| CN-109411773-A | A kind of palladium copper-golden nanometer thorn-like elctro-catalyst and preparation method thereof | 浙江工业大学 | 2019-03-01 | — | — | CN | disclosed |
| US-20060091561-A1 | Electronic component comprising external surface contacts and a method for producing the same | QIMONDA AG (DE) | 2006-05-04 | — | — | US | disclosed |