Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17766161 | 0.98 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL19124444 | 0.98 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL17766110 | 0.98 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL6048419 | 0.95 | PTGS1 (0.34) | PTGS1PTGS2 | |
| SCHEMBL202671 | 0.88 | PTGS1 (0.35) | PTGS1PTGS2 | |
| SCHEMBL188314 | 0.87 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL17766112 | 0.87 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL17713990 | 0.87 | PTGS1 (0.34) | PTGS1PTGS2 | |
| SCHEMBL17766172 | 0.86 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL17766146 | 0.86 | PTGS1 (0.33) | PTGS1PTGS2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| CN-117529405-A | Hard coating film, method for producing the same, and display | 株式会社钟化 | 2024-02-06 | — | — | CN | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| CN-114008113-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-05-02 | — | — | CN | disclosed |
| US-20220340777-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-10-27 | — | — | US | disclosed |
| WO-2022202173-A1 | CURABLE RESIN COMPOSITION AND USE THEREOF | 株式会社カネカ | 2022-09-29 | — | — | WO | disclosed |
| CN-115003759-A | Resin composition, method for producing same, and multi-component curable resin composition | 株式会社钟化 | 2022-09-02 | — | — | CN | disclosed |
| CN-110651336-B | Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition | 株式会社钟化 | 2022-05-17 | — | — | CN | disclosed |
| US-6180287-B1 | Polyether copolymer and solid polymer electrolyte | DAISO CO., LTD. (JP) | 2001-01-30 | — | — | US | disclosed |
| US-6162563-A | Polymer Solid Electrolyte | DAISO CO., LTD (JP) | 2000-12-19 | — | — | US | disclosed |
| US-6159389-A | Polyether copolymer and crosslinked solid polymer electrolyte | DAISO CO., LTD. (JP) | 2000-12-12 | — | — | US | disclosed |
| EP-0994143-A1 | Solid polymer electrolyte and use thereof | DAISO CO., LTD. (JP) | 2000-04-19 | — | — | EP | disclosed |
| US-5968681-A | Polyether copolymer and polymer solid electrolyte | DAISO CO., LTD (JP) | 1999-10-19 | — | — | US | disclosed |
| EP-0945476-A1 | Polyether copolymer and crosslinked solid polymer electrolyte | DAISO CO., LTD. (JP) | 1999-09-29 | — | — | EP | disclosed |
| EP-0897941-A1 | CROSS-LINKED SOLID POLYELECTROLYTE AND USE THEREOF | DAISO CO., LTD. (JP) | 1999-02-24 | — | — | EP | disclosed |
| EP-0885913-A1 | COPOLYETHER AND SOLID POLYMER ELECTROLYTE | DAISO CO., LTD. (JP) | 1998-12-23 | — | — | EP | disclosed |
| EP-0856538-A1 | SOLID POLYELECTROLYTE | DAISO CO., LTD. (JP) | 1998-08-05 | — | — | EP | disclosed |
| EP-0838487-A2 | Polyether copolymer and polymer solid electrolyte | DAISO CO., LTD. (JP) | 1998-04-29 | — | — | EP | disclosed |