SCHEMBL6062033

SCHEMBL6062033

CC/C=C/OC(O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6062040 1.00
SCHEMBL6062824 0.81
SCHEMBL6062837 0.81
SCHEMBL9725284 0.81
SCHEMBL6063526 0.77
SCHEMBL6062104 0.77
SCHEMBL6063533 0.77
SCHEMBL6836188 0.77
SCHEMBL6062120 0.77
SCHEMBL5438127 0.74 TSHR (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250197621-A1 THERMOPLASTIC RESIN COMPOSITION MITSUI CHEMICALS, INC. (JP) 2025-06-19 US disclosed
EP-4495182-A1 THERMOPLASTIC RESIN COMPOSITION Mitsui Chemicals, Inc. (JP) 2025-01-22 EP disclosed
CN-118871529-A Thermoplastic resin composition 三井化学株式会社 2024-10-29 CN disclosed
WO-2024204149-A1 ADHESIVE COMPOSITION AND METHOD FOR PRODUCING SAME, AND ADHESIVE SHEET 三井化学株式会社 2024-10-03 WO disclosed
WO-2023176788-A1 THERMOPLASTIC RESIN COMPOSITION 三井化学株式会社 2023-09-21 WO disclosed
EP-0919595-B1 MOLDING RESIN COMPOSITION MITSUI CHEMICALS INC (JP) 2006-04-26 EP disclosed
US-6221961-B1 Molding resin composition MITSUI CHEMICALS, INC. (JP) 2001-04-24 US disclosed
EP-0919595-A1 MOLDING RESIN COMPOSITION Mitsui Chemicals, Inc. (JP) 1999-06-02 EP disclosed