SCHEMBL6062833

SCHEMBL6062833

CC=CCOCCCCO

nearest known ligand 0.37

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.37
MEN1 O00255 1/20 0.35
THRB P10828 1/20 0.35
HTT P42858 1/20 0.35
KMT2A Q03164 1/20 0.35
MAPT P10636 1/20 0.35
TSHR P16473 1/20 0.34
CYP4F2 P78329 1/20 0.33
CYP4A11 Q02928 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8748516 1.00 GAA (0.37) GAAMEN1THRBHTTKMT2A
SCHEMBL30415575 0.98 GAA (0.40) GAAMEN1THRBHTTKMT2A
SCHEMBL30415787 0.98 GAA (0.40) GAAMEN1THRBHTTKMT2A
SCHEMBL6062037 0.93
SCHEMBL11109541 0.85 LSS (0.32) MEN1THRBHTTKMT2AMAPT
SCHEMBL3241237 0.85 LSS (0.32) MEN1THRBHTTKMT2AMAPT
SCHEMBL8835716 0.83
SCHEMBL1325789 0.83
SCHEMBL12073489 0.83
SCHEMBL5603650 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250197621-A1 THERMOPLASTIC RESIN COMPOSITION MITSUI CHEMICALS, INC. (JP) 2025-06-19 US disclosed
EP-4495182-A1 THERMOPLASTIC RESIN COMPOSITION Mitsui Chemicals, Inc. (JP) 2025-01-22 EP disclosed
CN-118871529-A Thermoplastic resin composition 三井化学株式会社 2024-10-29 CN disclosed
WO-2024204149-A1 ADHESIVE COMPOSITION AND METHOD FOR PRODUCING SAME, AND ADHESIVE SHEET 三井化学株式会社 2024-10-03 WO disclosed
CN-114728306-B Thermosetting resin composition, cured film, method for forming multilayer coating film, ester compound, and polymer 共荣社化学株式会社 2024-06-14 CN disclosed
CN-118019808-A Curable resin composition 共荣社化学株式会社 2024-05-10 CN disclosed
CN-113646346-B Thermosetting resin composition, method for forming coating film, and cured coating film 共荣社化学株式会社 2023-09-22 CN disclosed
WO-2023176788-A1 THERMOPLASTIC RESIN COMPOSITION 三井化学株式会社 2023-09-21 WO disclosed
CN-113646347-B Aqueous thermosetting resin composition and cured film 共荣社化学株式会社 2023-05-23 CN disclosed
EP-0919595-B1 MOLDING RESIN COMPOSITION MITSUI CHEMICALS INC (JP) 2006-04-26 EP disclosed
US-6753441-B1 CONDENSING, IN WATER AND BASE, HYDROXYLATED AROMATIC COMPOUND WITH GLYOXYLIC ACID USING POLYCARBOXYLIC ACID CATALYST RHODIA CHIMIE (FR) 2004-06-22 US disclosed
EP-1087924-B1 METHOD FOR PREPARING P-HYDROXYMANDELIC COMPOUNDS OPTIONALLY SUBSTITUTED RHODIA CHIMIE SA (FR) 2004-02-25 EP disclosed
US-6221961-B1 Molding resin composition MITSUI CHEMICALS, INC. (JP) 2001-04-24 US disclosed
EP-1087924-A1 METHOD FOR PREPARING P-HYDROXYMANDELIC COMPOUNDS OPTIONALLY SUBSTITUTED RHODIA CHIMIE (FR) 2001-04-04 EP disclosed
WO-1999065853-A1 METHOD FOR PREPARING P-HYDROXYMANDELIC COMPOUNDS OPTIONALLY SUBSTITUTED RHODIA CHIMIE (FR) 1999-12-23 WO disclosed
EP-0919595-A1 MOLDING RESIN COMPOSITION Mitsui Chemicals, Inc. (JP) 1999-06-02 EP disclosed
US-5661206-A MODIFYING THE FLUIDITY BY ADDING OXYALKYLENE BASED DEFOAMING AGENT; EXTENDED SHELF-LIFE MBT HOLDING AG (CH) 1997-08-26 US disclosed
US-5430183-A Para-hydroxyalkylation of hydroxylated aromatic compounds RHONE-POULENC CHIMIE (FR) 1995-07-04 US disclosed