⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9340209 | 0.91 | — | — | |
| SCHEMBL6093591 | 0.76 | — | — | |
| SCHEMBL11930086 | 0.65 | — | — | |
| SCHEMBL458633 | 0.63 | — | — | |
| SCHEMBL16754847 | 0.63 | — | — | |
| SCHEMBL8203195 | 0.60 | — | — | |
| SCHEMBL21256206 | 0.58 | — | — | |
| SCHEMBL5693 | 0.58 | — | — | |
| SCHEMBL16869969 | 0.58 | — | — | |
| SCHEMBL15593531 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7148144-B1 | Method of forming copper sulfide layer over substrate | SPANSION LLC (US) | 2006-12-12 | — | — | US | claimed |
| US-5346730-A | Process for depositing a copper containing layer I | KALI-CHEMIE AG (DE) | 1994-09-13 | — | — | US | claimed |
| EP-0468396-B1 | Process for depositing a copper-containing layer | KALI CHEMIE AG (DE) | 1994-06-29 | — | — | EP | claimed |
| US-7148144-B1 | Method of forming copper sulfide layer over substrate | SPANSION LLC (US) | 2006-12-12 | — | — | US | disclosed |
| US-5518536-A | CHEMICAL VAPOR DEPOSITION SYSTHESIS, HIGH TEMPERATURE SUPERCONDUCTORS | SOLVAY BARIUM STRONTIUM GMBH (DE) | 1996-05-21 | — | — | US | disclosed |
| US-5451434-A | Chemical vapor deposition of oxides for high temperature superconductors | SOLVAY BARIUM STRONTIUM GMBH (DE) | 1995-09-19 | — | — | US | disclosed |
| US-5346730-A | Process for depositing a copper containing layer I | KALI-CHEMIE AG (DE) | 1994-09-13 | — | — | US | disclosed |