SCHEMBL6131094

SCHEMBL6131094

CCCC[PH](C)(CCCC)CCCC.OB(O)Oc1cccc2ccc3cc4ccccc4cc3c12

nearest known ligand 0.33

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 2/20 0.33
CNR2 P34972 1/20 0.32
HTR1B P28222 3/20 0.31
RXRA P19793 1/20 0.30
PPARG P37231 1/20 0.30
PPARD Q03181 1/20 0.30
PPARA Q07869 1/20 0.30
ERBB2 P04626 1/20 0.30
CYP1A2 P05177 1/20 0.30
FYN P06241 1/20 0.30
MAOA P21397 1/20 0.30
ACHE P22303 1/20 0.30
AHR P35869 1/20 0.30
HTR1D P28221 1/20 0.30
CETP P11597 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL995087 0.92 KCNH2 (0.33) KCNH2CNR2HTR1BRXRAPPARG
Butylamine SCHEMBL8463894 0.88 HTR1B (0.40) KCNH2CNR2HTR1BRXRAPPARG
SCHEMBL7871279 0.88 KCNH2 (0.31) KCNH2CNR2
SCHEMBL7639889 0.88 KCNH2 (0.31) KCNH2CNR2
SCHEMBL6740810 0.86 CYP1A2 (0.37) RXRAPPARGPPARDPPARAERBB2
SCHEMBL7874385 0.86 KCNH2 (0.31) KCNH2
SCHEMBL18632612 0.86 KCNH2 (0.34) KCNH2CNR2HTR1BRXRAPPARG
Tetrabuthylammonium SCHEMBL4239923 0.85 KCNH2 (0.33) KCNH2CNR2HTR1BRXRAPPARG
SCHEMBL911197 0.85 HTR1B (0.47) KCNH2HTR1BHTR1D
SCHEMBL7640564 0.84 CYP1A2 (0.33) RXRAPPARGPPARDPPARAERBB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107312161-B Epoxy resin composition, semi-cured or cured epoxy resin composition, method for producing the same, and product using the same 日立化成株式会社 2021-10-26 CN disclosed
CN-111919273-A Supercapacitor assembly with barrier layer 阿维科斯公司 2020-11-10 CN disclosed
CN-111742384-A Packaged supercapacitor module with high voltage and low equivalent series resistance 阿维科斯公司 2020-10-02 CN disclosed
US-6881799-B2 Curing agent for epoxy resins and epoxy resin composition RESOLUTION PERFORMANCE PRODUCTS LLC (US) 2005-04-19 US disclosed
US-20040054119-A1 Curing agent for epoxy resins and epoxy resin composition Westlake Epoxy Inc. 2004-03-18 US disclosed
EP-1352027-A2 CURING AGENT FOR EPOXY RESINS AND EPOXY RESIN COMPOSITION Resolution Research Nederland B.V. (NL) 2003-10-15 EP disclosed
WO-2002057361-A2 CURING AGENT FOR EPOXY RESINS AND EPOXY RESIN COMPOSITION RESOLUTION RESEARCH NEDERLAND B.V. (NL) 2002-07-25 WO disclosed
US-5872196-A CURING AGENT AND ACCELERATOR FOR EPOXY RESINS SHELL OIL COMPANY (US) 1999-02-16 US disclosed
US-5756564-A WATERPROOFING COATING SHELL OIL COMPANY (US) 1998-05-26 US disclosed