Ethyne

Ethyne

SCHEMBL6132211

C#C.[C].[C]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethyne SCHEMBL31519385 1.00
Ethyne SCHEMBL10805537 1.00
Ethyne SCHEMBL98802 1.00
Ethyne SCHEMBL6272096 0.82
Ethyne SCHEMBL27961050 0.82
Ethyne SCHEMBL4753041 0.82
Ethyne SCHEMBL428 0.82
Ethyne SCHEMBL144006 0.82
Ethyne SCHEMBL8634307 0.67
Ethyne SCHEMBL3320792 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021065964-A1 CURABLE COMPOSITION CONTAINING POLYPHENYLENE ETHER; DRY FILM; PREPREG; CURED PRODUCT; LAMINATE PLATE; AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2021-04-08 WO disclosed
US-20050175850-A1 Flexible metal laminate and heat-resistant adhesive composition TOMOEGAWA PAPER CO., LTD (JP) 2005-08-11 US disclosed
US-20050104214-A1 Flexible metal stacked body TOMOEGAWA PAPER CO., LTD. (JP) 2005-05-19 US disclosed