⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL613355 | 1.00 | — | — | |
| SCHEMBL8853335 | 0.94 | EP300 (0.35) | — | |
| SCHEMBL8853193 | 0.94 | EP300 (0.35) | — | |
| SCHEMBL8853345 | 0.94 | EP300 (0.35) | — | |
| SCHEMBL8853201 | 0.94 | EP300 (0.35) | — | |
| SCHEMBL4740941 | 0.88 | — | — | |
| SCHEMBL2432232 | 0.88 | — | — | |
| SCHEMBL17889185 | 0.82 | — | — | |
| SCHEMBL17889187 | 0.82 | — | — | |
| SCHEMBL28095192 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 508 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12331229-B2 | Silicone adhesive composition and methods for its preparation and use for electronic device fabrication | DOW SILICONES CORPORATION (US) | 2025-06-17 | — | — | US | claimed |
| EP-3673027-B1 | DUAL CURE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE | DOW SILICONES CORP (US) | 2023-11-01 | — | — | EP | claimed |
| US-20230313008-A1 | SILICONE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE FOR ELECTRONIC DEVICE FABRICATION | DOW CHEMICAL SILICONES KOREA, LTD. (KR) | 2023-10-05 | — | — | US | claimed |
| EP-4153656-A1 | SILICONE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE FOR ELECTRONIC DEVICE FABRICATION | Dow Silicones Corporation (US) | 2023-03-29 | — | — | EP | claimed |
| CN-115667370-A | Silicone adhesive composition, method for preparing same and use for electronic device manufacture | 美国陶氏有机硅公司 | 2023-01-31 | — | — | CN | claimed |
| CN-111051461-B | Dual cure adhesive compositions and methods of making and using the same | 美国陶氏有机硅公司 | 2022-04-26 | — | — | CN | claimed |
| CN-111051461-A | Dual cure adhesive compositions and methods of making and using the same | 美国陶氏有机硅公司 | 2020-04-21 | — | — | CN | claimed |
| JP-4597365-B2 | — | — | 2010-12-15 | — | — | JP | claimed |
| EP-1444298-B9 | THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYESTER RESINS | DOW CORNING (US) | 2010-03-03 | — | — | EP | claimed |
| EP-1444298-B1 | THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYESTER RESINS | DOW CORNING (US) | 2009-10-07 | — | — | EP | claimed |
| JP-2002505366-A | — | — | 2002-02-19 | — | — | JP | claimed |
| WO-2002008335-A2 | THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYAMIDE RESINS | DOW CORNING CORPORATION (US) | 2002-01-31 | — | — | WO | claimed |
| WO-2001072903-A2 | THERMOPLASTIC SILICONE POLYAMIDE ELASTOMERS | DOW CORNING CORPORATION (US) | 2001-10-04 | — | — | WO | claimed |
| US-6281286-B1 | DYNAMICALLY CURING BLEND | DOW CORNING CORPORATION | 2001-08-28 | — | — | US | claimed |
| WO-2001018116-A1 | WITH SILICON RUBBER TOUGHENED THERMOPLASTIC RESINS | DOW CORNING CORPORATION (US) | 2001-03-15 | — | — | WO | claimed |
| EP-1060217-A1 | THERMOPLASTIC SILICONE ELASTOMERS | DOW CORNING CORPORATION (US) | 2000-12-20 | — | — | EP | claimed |
| EP-0860487-B1 | Silicone release coating compositions | DOW CORNING ASIA LTD (JP) | 2000-07-12 | — | — | EP | claimed |
| US-6013715-A | DISPERSING A SILICONE GUM IN A THERMOPLASTIC RESIN WITH A HYDROSILATION CATALYST AND FILLER, VULCANIZING AND DYNAMIC CURING | DOW CORNING CORPORATION (US) | 2000-01-11 | — | — | US | claimed |
| WO-1999045072-A1 | THERMOPLASTIC SILICONE ELASTOMERS | DOW CORNING CORPORATION (US) | 1999-09-10 | — | — | WO | claimed |
| EP-0655483-B1 | Curable organopolysiloxane composition | DOW CORNING TORAY SILICONE (JP) | 1997-09-03 | — | — | EP | claimed |