SCHEMBL615239

SCHEMBL615239

CC(S)CC([O])=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8612540 0.75
SCHEMBL20966262 0.75
SCHEMBL3076083 0.75
SCHEMBL2290676 0.75
SCHEMBL98745 0.75
SCHEMBL13310877 0.75
SCHEMBL27107 0.73
SCHEMBL3953908 0.73
SCHEMBL17130392 0.73
SCHEMBL3069492 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114729252-A Adhesive composition, adhesive film, and connection structure 迪睿合株式会社 2022-07-08 CN disclosed
WO-2022004641-A1 FLUORINE-CONTAINING COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, AND PRODUCTION METHOD FOR MOLDED PRODUCT AGCセイミケミカル株式会社 2022-01-06 WO disclosed
WO-2021261498-A1 COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING CURED PRODUCT 株式会社ADEKA 2021-12-30 WO disclosed
CN-113227010-A Hydrofluoric acid-resistant resist composition and substrate processed product obtained using same 太阳油墨制造株式会社 2021-08-06 CN disclosed
WO-2021141011-A1 LATEX COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY 昭和電工株式会社 2021-07-15 WO disclosed
WO-2021117604-A1 ADHESIVE COMPOSITION, ADHESIVE FILM AND CONNECTION STRUCTURE デクセリアルズ株式会社 2021-06-17 WO disclosed
US-20210011376-A1 PHOTOSENSITIVE TRANSFER MATERIAL, ELECTRODE PROTECTIVE FILM, LAMINATE, CAPACITIVE INPUT DEVICE, AND MANUFACTURING METHOD OF TOUCH PANEL FUJIFILM CORPORATION (JP) 2021-01-14 US disclosed
US-20200363721-A1 PHOTOSENSITIVE TRANSFER MATERIAL, ELECTRODE PROTECTIVE FILM, LAMINATE, CAPACITIVE INPUT DEVICE, AND MANUFACTURING METHOD OF TOUCH PANEL FUJIFILM CORPORATION (JP) 2020-11-19 US disclosed
WO-2020130155-A1 HYDROFLUORIC ACID-RESISTANT RESIST COMPOSITION, AND PROCESSED SUBSTRATE PRODUCT PRODUCED USING SAME 太陽インキ製造株式会社 2020-06-25 WO disclosed
WO-2020085220-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD リンテック株式会社 2020-04-30 WO disclosed
WO-2020066405-A1 STACKED BODY, STACKED BODY MANUFACTURING METHOD, AND CAPACITIVE INPUT DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed
CN-106488941-B Resin, photosensitive resin composition, cured product, color filter, and image display device 三菱化学株式会社 2019-12-10 CN disclosed
EP-2423282-B1 THIOL GROUP-CONTAINING ADHESIVE RESIN COMPOSITION BRIDGESTONE CORP (JP) 2018-07-18 EP disclosed
US-8865841-B2 Thiol-containing liquid rubber composition BRIDGESTONE CORPORATION (JP) 2014-10-21 US disclosed
CN-102224193-B Thermosetting composition BRIDGESTONE CORP 2014-04-02 CN disclosed
CN-102803417-A Thiol Group-containing Adhesive Resin Composition BRIDGESTONE CORP 2012-11-28 CN disclosed
US-20120071579-A1 THIOL GROUP- CONTAINING ADHESIVE RESIN COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-03-22 US disclosed
EP-2423282-A1 THIOL GROUP-CONTAINING ADHESIVE RESIN COMPOSITION Bridgestone Corporation (JP) 2012-02-29 EP disclosed
EP-2420535-A1 THIOL-CONTAINING LIQUID RUBBER COMPOSITION Bridgestone Corporation (JP) 2012-02-22 EP disclosed
US-20120041154-A1 THIOL-CONTAINING LIQUID RUBBER COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-02-16 US disclosed