SCHEMBL6156789

SCHEMBL6156789

C=C[Si](C)(C)[Si](C)(C)[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL236976 0.85
SCHEMBL10826388 0.77
SCHEMBL1493192 0.76
SCHEMBL28657229 0.72
SCHEMBL6678532 0.69
SCHEMBL1793717 0.69
SCHEMBL29331266 0.67
SCHEMBL23200485 0.65
SCHEMBL31316934 0.64
SCHEMBL9719918 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0715488-B1 Metal-foil-clad composite ceramic board and process for the production thereof MITSUBISHI GAS CHEMICAL CO (JP) 2005-02-09 EP disclosed
US-20020190409-A1 Method for reinforcing ceramic composites and ceramic composites including an improved reinforcement system BURDSALL CHARLES W (US) 2002-12-19 US disclosed
US-6207230-B1 IMPREGNATING INORGANIC POROUS SINTERED BODY WITH ORGANOMETALLIC COMPOUND, HEAT-TREATING IMPREGNATED BODY TO DECOMPOSE ORGANOMETALLIC COMPOUND FORMING CARBIDE, NITRIDE, OXIDE, FILLING RESIN IN PORES, CURING MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-03-27 US disclosed
US-6113730-A IMPREGNATING SINTERED SUBSTRATE OF INORGANIC CONTINUOUSLY POROUS SINTERED BODY WITH THERMOSETTING RESIN UNDER VACUUM, TO FORM RESIN-IMPRGNATED SINTERED SUBSTRATE, STACKING METAL FOIL; PRESS-FORMING LAMINATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-09-05 US disclosed
US-5876659-A Process for producing fiber reinforced composite HITACHI, LTD. (JP) 1999-03-02 US disclosed
US-5686172-A PRINTED CIRCUITS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1997-11-11 US disclosed
EP-0715488-A1 Metal-foil-clad composite ceramic board and process for the production thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1996-06-05 EP disclosed