Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 3/20 | 0.43 |
| ▸ | HDAC2 | Q92769 | 3/20 | 0.43 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.43 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.43 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.43 |
| ▸ | HDAC5 | Q9UQL6 | 2/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.36 |
| ▸ | FAAH | O00519 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | RECQL | P46063 | 1/20 | 0.34 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.33 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.33 |
| ▸ | HDAC10 | Q969S8 | 1/20 | 0.33 |
| ▸ | HDAC11 | Q96DB2 | 1/20 | 0.33 |
| ▸ | HDAC9 | Q9UKV0 | 1/20 | 0.33 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.33 |
| ▸ | MMP3 | P08254 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10634612 | 0.97 | HDAC1 (0.48) | HDAC1HDAC2HDAC3HDAC8HDAC6 | |
| SCHEMBL10631623 | 0.94 | KDM4E (0.39) | HDAC1HDAC2HDAC3HDAC8HDAC6 | |
| SCHEMBL10500311 | 0.91 | HDAC3 (0.37) | HDAC1HDAC2HDAC3HDAC8HDAC6 | |
| SCHEMBL3295884 | 0.89 | HSP90AA1 (0.54) | SMN1; SMN2TSHRHSP90AA1FAAHHDAC11 | |
| SCHEMBL10631952 | 0.88 | MCL1 (0.36) | KDM4EMCL1 | |
| Palmitoyalcyanamide SCHEMBL3296666 | 0.87 | HSP90AA1 (0.57) | TSHRHSP90AA1FAAHHDAC11ALDH1A1 | |
| SCHEMBL3294110 | 0.87 | HSP90AA1 (0.57) | TSHRHSP90AA1FAAHHDAC11ALDH1A1 | |
| SCHEMBL3295680 | 0.87 | HSP90AA1 (0.57) | TSHRHSP90AA1FAAHHDAC11ALDH1A1 | |
| SCHEMBL3297352 | 0.87 | HSP90AA1 (0.57) | TSHRHSP90AA1FAAHHDAC11ALDH1A1 | |
| Stearoylcyanamide SCHEMBL3297220 | 0.87 | HSP90AA1 (0.57) | TSHRHSP90AA1FAAHHDAC11ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11834574-B2 | Dual cure additive manufacturing resins for production of flame retardant objects | CARBON, INC. (US) | 2023-12-05 | — | — | US | disclosed |
| US-11833744-B2 | Dual precursor resin systems for additive manufacturing with dual cure resins | CARBON, INC. (US) | 2023-12-05 | — | — | US | disclosed |
| US-11814472-B2 | Epoxy dual cure resins for additive manufacturing | CARBON, INC. (US) | 2023-11-14 | — | — | US | disclosed |
| US-20230143277-A1 | DUAL CURE STEREOLITHOGRAPHY RESINS CONTAINING DIELS-ALDER ADDUCTS | CARBON INC (US) | 2023-05-11 | — | — | US | disclosed |
| US-11629202-B2 | Dual cure stereolithography resins containing thermoplastic particles | CARBON, INC. (US) | 2023-04-18 | — | — | US | disclosed |
| EP-3849806-B1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON INC (US) | 2023-04-05 | — | — | EP | disclosed |
| US-20230095097-A1 | TOUGH, HIGH TEMPERATURE POLYMERS PRODUCED BY STEREOLITHOGRAPHY | CARBON INC (US) | 2023-03-30 | — | — | US | disclosed |
| US-11555095-B2 | Dual cure resin for the production of moisture-resistant articles by additive manufacturing | CARBON, INC. (US) | 2023-01-17 | — | — | US | disclosed |
| US-11535686-B2 | Tough, high temperature polymers produced by stereolithography | CARBON, INC. (US) | 2022-12-27 | — | — | US | disclosed |
| US-20220325093-A1 | DUAL CURE ADDITIVE MANUFACTURING RESINS FOR PRODUCTION OF FLAME RETARDANT OBJECTS | CARBON INC (US) | 2022-10-13 | — | — | US | disclosed |
| EP-1414902-B1 | EPOXY RESIN | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2007-02-28 | — | — | EP | disclosed |
| US-20040234773-A1 | A curable liquid blends comprising amines, latent curing agent which does not react until temperatures above 70 degrees C., a photopolymerizable compound and a photoinitiator; use as impregnating resins, forming fibre-reinforced composite materials | HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (N/K/A HUNTSMAN ADVANCED MATERIALS AMERICAS LLC) | 2004-11-25 | — | — | US | disclosed |
| EP-1414902-A1 | EPOXY RESIN | Vantico AG (CH) | 2004-05-06 | — | — | EP | disclosed |
| WO-2003011971-A1 | EPOXY RESIN | VANTICO AG (CH) | 2003-02-13 | — | — | WO | disclosed |
| EP-1185574-A2 | POLY(MERCAPTOPROPYLARYL) CURATIVES | Lord Corporation (US) | 2002-03-13 | — | — | EP | disclosed |
| US-6313257-B1 | Poly (mercaptopropylaryl) curatives | LORD CORPORATION | 2001-11-06 | — | — | US | disclosed |
| WO-2001000698-A2 | POLY(MERCAPTOPROPYLARYL) CURATIVES | LORD CORPORATION (US) | 2001-01-04 | — | — | WO | disclosed |
| US-5214098-A | Dicyandiamide, impregnation of fiber composites, prepregs | CIBA-GEIGY CORPORATION (US) | 1993-05-25 | — | — | US | disclosed |
| US-4721770-A | MOLDING MATERIALS | CIBA-GEIGY CORPORATION (US) | 1988-01-26 | — | — | US | disclosed |
| US-4618712-A | HARDENER FOR EPOXIDE RESINS | CIBA-GEIGY CORPORATION (US) | 1986-10-21 | — | — | US | disclosed |