SCHEMBL620516

SCHEMBL620516

CC1(CCO)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3198538 0.84
SCHEMBL3376597 0.82 EPHX1 (0.54)
SCHEMBL3421815 0.80 EPHX1 (0.52)
SCHEMBL3418338 0.80 EPHX1 (0.52)
SCHEMBL879886 0.80 EPHX1 (0.52)
SCHEMBL23292810 0.80 EPHX1 (0.52)
SCHEMBL850397 0.80 EPHX1 (0.52)
SCHEMBL3418448 0.80 EPHX1 (0.52)
SCHEMBL13130049 0.77 EPHX1 (0.52)
SCHEMBL6002 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 453 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119505103-A Counterweight technology for fan 东莞市兆科电子材料科技有限公司 2025-02-25 CN claimed
CN-117510701-A Water-absorbent resin particle, preparation method thereof and absorber 中国天辰工程有限公司 2024-02-06 CN claimed
US-7683104-B2 Curable composition, ink composition, inkjet-recording method, and planographic printing plate FUJIFILM CORPORATION (JP) 2010-03-23 US claimed
EP-4737507-A1 METHOD FOR PRODUCING WATER-ABSORBING RESIN PARTICLES, WATER-ABSORBING RESIN PARTICLES, ABSORBER, AND ABSORBENT ARTICLE Sumitomo Seika Chemicals Co., Ltd. (JP) 2026-05-06 EP disclosed
EP-4732816-A1 DEODORANT COMPOSITION Sumitomo Seika Chemicals Co., Ltd. (JP) 2026-04-29 EP disclosed
EP-4435064-B1 NONAQUEOUS INKJET INK AND METHOD FOR FORMING CURED PRODUCT KONICA MINOLTA INC (JP) 2026-04-22 EP disclosed
US-12583999-B2 Water-absorbing resin particles, absorbing body, and absorbent article SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2026-03-24 US disclosed
EP-4711426-A1 ACTIVE RAY-CURABLE INKJET INK COMPOSITION, METHOD FOR FORMING INSULATING FILM, INSULATING FILM, AND PRINTED WIRING BOARD KONICA MINOLTA, INC. (JP) 2026-03-18 EP disclosed
US-20260061393-A1 METHOD FOR PRODUCING WATER-ABSORBENT RESIN PARTICLES SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2026-03-05 US disclosed
EP-4696719-A1 METHOD FOR PRODUCING WATER-ABSORBING RESIN PARTICLES, WATER-ABSORBING RESIN PARTICLES, ABSORBER, AND ABSORBENT ARTICLE Sumitomo Seika Chemicals Co., Ltd. (JP) 2026-02-18 EP disclosed
EP-4691627-A1 PARTICULATE WATER ABSORBENT, ABSORBER CONTAINING SAID PARTICULATE WATER ABSORBENT, AND SANITARY PRODUCT CONTAINING SAID ABSORBER Nippon Shokubai Co., Ltd. (JP) 2026-02-11 EP disclosed
US-7014310-B2 Inkjet image forming method and inkjet image forming system KONICA CORPORATION (JP) 2006-03-21 US disclosed
EP-1594557-A1 WATER-ABSORBENT RESIN COMPOSITION AND ITS PRODUCTION PROCESS Nippon Shokubai Co., Ltd. (JP) 2005-11-16 EP disclosed
WO-2005097313-A1 AN AQUEOUS-LIQUID-ABSORBING AGENT AND ITS PRODUCTION PROCESS NIPPON SHOKUBAI CO., LTD. (JP) 2005-10-20 WO disclosed
WO-2005075445-A2 (METH) ACRYLOYL GROUP-CONTAINING OXETANE COMPOUND AND PRODUCTION METHOD THEREOF SHOWA DENKO K.K. (JP) 2005-08-18 WO disclosed
US-20050070671-A1 Water-absorbent resin having treated surface and process for producing the same NIPPON SHOKUBAI CO., LTD. (JP) 2005-03-31 US disclosed
EP-1516884-A2 Water-absorbent resin having treated surface and process for producing the same Nippon Shokubai Co., Ltd. (JP) 2005-03-23 EP disclosed
WO-2004069293-A1 WATER-ABSORBENT RESIN COMPOSITION AND ITS PRODUCTION PROCESS NIPPON SHOKUBAI CO., LTD. (JP) 2004-08-19 WO disclosed
US-20040036753-A1 Ink-jet image forming method KONICA CORPORATION (JP) 2004-02-26 US disclosed
US-20030202079-A1 Inkjet image forming method and inkjet image forming system KONICA CORPORATION (JP) 2003-10-30 US disclosed