Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 1/20 | 0.55 |
| ▸ | CA12 | O43570 | 4/20 | 0.50 |
| ▸ | CA2 | P00918 | 4/20 | 0.50 |
| ▸ | CA4 | P22748 | 4/20 | 0.50 |
| ▸ | CA6 | P23280 | 4/20 | 0.50 |
| ▸ | CA5A | P35218 | 4/20 | 0.50 |
| ▸ | CA7 | P43166 | 4/20 | 0.50 |
| ▸ | CA9 | Q16790 | 4/20 | 0.50 |
| ▸ | CA14 | Q9ULX7 | 4/20 | 0.50 |
| ▸ | CA5B | Q9Y2D0 | 4/20 | 0.50 |
| ▸ | DNM1 | Q05193 | 4/20 | 0.50 |
| ▸ | CA1 | P00915 | 3/20 | 0.50 |
| ▸ | CA3 | P07451 | 3/20 | 0.50 |
| ▸ | TSHR | P16473 | 3/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.50 |
| ▸ | F13A1 | P00488 | 2/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.50 |
| ▸ | THPO | P40225 | 2/20 | 0.50 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1408882 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL8502653 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL1408947 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL1408762 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL15283367 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL487567 | 1.00 | — | — | |
| SCHEMBL1408879 | 1.00 | EPHX1 (0.55) | EPHX1CA12CA2CA4CA6 | |
| SCHEMBL34358 | 1.00 | — | — | |
| SCHEMBL180051 | 0.97 | — | — | |
| Hydrochloric Acid SCHEMBL28910574 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11859051-B2 | Polyamides with in-backbone optical absorbers and related methods | XEROX CORPORATION (US) | 2024-01-02 | — | — | US | claimed |
| US-20210070934-A1 | POLYAMIDES WITH IN-BACKBONE OPTICAL ABSORBERS AND RELATED METHODS | XEROX CORPORATION (US) | 2021-03-11 | — | — | US | claimed |
| EP-3789421-A1 | POLYAMIDES WITH IN-BACKBONE OPTICAL ABSORBERS AND RELATED METHODS | Xerox Corporation (US) | 2021-03-10 | — | — | EP | claimed |
| CN-112457486-A | Polyamides with light absorbers in the main chain and related methods | 施乐公司 | 2021-03-09 | — | — | CN | claimed |
| CN-110872473-A | Slurry composition for chemical mechanical polishing | 三星电子株式会社 | 2020-03-10 | — | — | CN | claimed |
| US-20200071566-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING | KCTECH CO., LTD. (KR) | 2020-03-05 | — | — | US | claimed |
| EP-1023358-B8 | PARTIALLY AROMATIC POLYAMIDES AND A PROCESS FOR MAKING THEM | DU PONT (US) | 2005-06-08 | — | — | EP | claimed |
| EP-1023358-B1 | PARTIALLY AROMATIC POLYAMIDES AND A PROCESS FOR MAKING THEM | DU PONT CANADA (CA) | 2005-04-13 | — | — | EP | claimed |
| US-6355769-B1 | OLIGOMERIZATION OF AROMATIC DICARBOXYLIC ACID AND ALIPHATIC DIAMINE; HEATING WITH AROMATIC DICARBOXYLIC ALKYL ESTER;ELECTRONICS, AUTOMOBILES; DIMENSIONAL STABILITY, HEAT RESISTANCE | DUPONT CANADA, INC. (CA) | 2002-03-12 | — | — | US | claimed |
| EP-1023358-A1 | PARTIALLY AROMATIC POLYAMIDES AND A PROCESS FOR MAKING THEM | DUPONT CANADA INC. (CA) | 2000-08-02 | — | — | EP | claimed |
| WO-1999018144-A1 | PARTIALLY AROMATIC POLYAMIDES AND A PROCESS FOR MAKING THEM | DUPONT CANADA INC. (CA) | 1999-04-15 | — | — | WO | claimed |
| US-20250215264-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING SAME, AND CHEMICAL MECHANICAL POLISHING METHOD OF WAFER | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-07-03 | — | — | US | disclosed |
| US-20250043149-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING APPARATUS | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-02-06 | — | — | US | disclosed |
| EP-3623398-B1 | RESIN COMPOSITION COMPRISING A MODIFIED BLOCK COPOLYMER AND METHOD FOR PRODUCING MODIFIED BLOCK COPOLYMER | ASAHI CHEMICAL IND (JP) | 2024-08-28 | — | — | EP | disclosed |
| US-12043755-B2 | Compositions, methods, and articles relating to in-situ crosslinking of polyamides during additive manufacturing | XEROX CORPORATION (US) | 2024-07-23 | — | — | US | disclosed |
| WO-1999012993-A1 | MANUFACTURE OF BRANCHED POLYAMIDES | DUPONT CANADA INC. (CA) | 1999-03-18 | — | — | WO | disclosed |
| EP-0558047-B1 | Copolymer having amino group and process for production thereof | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 1998-05-20 | — | — | EP | disclosed |
| US-5552480-A | BLEND, IMIDIZED ADDITION POLYMER, ENGINEERING PLASTIC, IMPACT STRENGTH | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 1996-09-03 | — | — | US | disclosed |
| EP-0558047-A2 | Copolymer having amino group and process for production thereof | DAI-ICHI KOGYO SEIYAKU Co., Ltd. (JP) | 1993-09-01 | — | — | EP | disclosed |
| EP-0558048-A1 | Thermoplastic resin composition | IDEMITSU PETROCHEMICAL COMPANY LIMITED (JP) | 1993-09-01 | — | — | EP | disclosed |