SCHEMBL6258089

SCHEMBL6258089

CCC(CO)(COCC(O)CO)COCC(O)CO

nearest known ligand 0.44

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.44
VDR P11473 7/20 0.33
KDM4E B2RXH2 3/20 0.33
LMNA P02545 2/20 0.33
DUSP3 P51452 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
PLA2G2C Q5R387 1/20 0.32
THRB P10828 1/20 0.31
ALDH1A1 P00352 1/20 0.31
AR P10275 4/20 0.31
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL937927 0.96 USP2 (0.44) USP2VDRKDM4ELMNADUSP3
SCHEMBL13024126 0.94 USP2 (0.41) USP2VDRKDM4ELMNADUSP3
SCHEMBL10806924 0.92 USP2 (0.47) USP2VDRKDM4ELMNADUSP3
SCHEMBL26792774 0.90 USP2 (0.38) USP2LMNA
SCHEMBL10044393 0.88 USP2 (0.44) USP2VDRKDM4ELMNADUSP3
SCHEMBL3690839 0.88 USP2 (0.47) USP2VDRKDM4ELMNADUSP3
SCHEMBL6285648 0.87 USP2 (0.41) USP2LMNATHRBALDH1A1
SCHEMBL1860602 0.87 USP2 (0.41) USP2LMNATHRBALDH1A1
SCHEMBL13024123 0.86 USP2 (0.43) USP2VDRKDM4ELMNADUSP3
SCHEMBL10089437 0.86 USP2 (0.38) USP2VDR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7824534-B2 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith NIPPON MINING & METALS CO., LTD. (JP) 2010-11-02 US disclosed
US-20100224496-A1 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith NIPPON MINING & METALS CO., LTD. 2010-09-09 US disclosed
US-20070170069-A1 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith JX NIPPON MINING & METALS CORPORATION (JP) 2007-07-26 US disclosed
US-6958193-B2 Laminated polyolefin films and methods of production thereof by coextrusion TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2005-10-25 US disclosed
EP-1477305-B1 Laminated polyolefin films and methods of production thereof by coextrusion TAKEMOTO OIL & FAT CO LTD (JP) 2005-10-12 EP disclosed
US-20040241452-A1 Laminated polyolefin films and methods of production thereof by coextrusion TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2004-12-02 US disclosed
EP-1477305-A1 Laminated polyolefin films and methods of production thereof by coextrusion Takemoto Yushi Kabushiki Kaisha (JP) 2004-11-17 EP disclosed