Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CXCR4 | P61073 | 2/20 | 0.44 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.35 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.34 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.34 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | PNMT | P11086 | 1/20 | 0.31 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6222124 | 0.93 | — | — | |
| SCHEMBL166845 | 0.86 | CXCR4 (0.57) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| SCHEMBL1409001 | 0.84 | CXCR4 (0.61) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| SCHEMBL21581271 | 0.84 | CXCR4 (0.61) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| SCHEMBL21581264 | 0.84 | CXCR4 (0.61) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| SCHEMBL1408768 | 0.84 | CXCR4 (0.61) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| Hydrochloric Acid SCHEMBL6959691 | 0.84 | CXCR4 (0.55) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 | |
| SCHEMBL415783 | 0.84 | — | — | |
| Hydrochloric Acid SCHEMBL16486635 | 0.82 | — | — | |
| SCHEMBL12003 | 0.79 | CXCR4 (0.56) | CXCR4SIGMAR1CHRM2CHRM4CHRM5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3781728-B1 | COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING | BASF SE (DE) | 2026-05-06 | — | — | EP | disclosed |
| US-12098473-B2 | Composition for cobalt plating comprising additive for void-free submicron feature filling | BASF SE (DE) | 2024-09-24 | — | — | US | disclosed |
| EP-3714085-B1 | COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT | BASF SE (DE) | 2023-08-09 | — | — | EP | disclosed |
| US-11585004-B2 | Composition for cobalt or cobalt alloy electroplating | BASF SE (DE) | 2023-02-21 | — | — | US | disclosed |
| US-20220298664-A1 | Composition for Cobalt Electroplating Comprising Leveling Agent | BASF SE (DE) | 2022-09-22 | — | — | US | disclosed |
| US-11377748-B2 | Composition for cobalt electroplating comprising leveling agent | BASF SE (DE) | 2022-07-05 | — | — | US | disclosed |
| US-20220018035-A1 | COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING | BASF SE (DE) | 2022-01-20 | — | — | US | disclosed |
| EP-3899107-A1 | COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING | BASF SE (DE) | 2021-10-27 | — | — | EP | disclosed |
| US-20210147994-A1 | COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING | BASF SE (DE) | 2021-05-20 | — | — | US | disclosed |
| EP-3781728-A2 | COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING | BASF SE (DE) | 2021-02-24 | — | — | EP | disclosed |
| US-8956523-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-02-17 | — | — | US | disclosed |
| US-20140081045-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-03-20 | — | — | US | disclosed |
| CN-103383530-A | Positive photoresist-cleaning agent composition | ZHANG FENG | 2013-11-06 | — | — | CN | disclosed |
| US-8329018-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-12-11 | — | — | US | disclosed |
| EP-1978051-B1 | Metal plating compositions and methods | ROHM & HAAS ELECT MAT (US) | 2012-02-22 | — | — | EP | disclosed |
| US-20110318479-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-12-29 | — | — | US | disclosed |
| US-8012334-B2 | provide good leveling performance and throwing power; additives to improve the brightness, ductility and plating distribution of the metal deposit | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-06 | — | — | US | disclosed |
| CN-102103334-A | Resist remover composition | DONGJIN SEMICHEM CO LTD | 2011-06-22 | — | — | CN | disclosed |
| US-20080268138-A1 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-10-30 | — | — | US | disclosed |
| EP-1978051-A1 | Metal plating compositions and methods | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-10-08 | — | — | EP | disclosed |