Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 8/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Diethyl Sulfide SCHEMBL28252020 | 0.96 | — | — | |
| Diethyl Sulfide SCHEMBL28168967 | 0.85 | — | — | |
| Propylamine SCHEMBL10445507 | 0.80 | — | — | |
| SCHEMBL5538671 | 0.79 | TSHR (0.41) | MEN1KMT2AALDH1A1TSHR | |
| SCHEMBL152661 | 0.79 | — | — | |
| Diethyl Sulfide SCHEMBL27467058 | 0.76 | — | — | |
| Diethyl Sulfide SCHEMBL9330658 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL737645 | 0.76 | — | — | |
| Propylamine SCHEMBL1330797 | 0.76 | — | — | |
| Diethyl Sulfide SCHEMBL11391850 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6965045-B2 | Organic metal precursor for use in forming metal containing patterned films | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-11-15 | — | — | US | disclosed |
| US-20030124457-A1 | Organic metal precursor for use in forming metal containing patterned films | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2003-07-03 | — | — | US | disclosed |
| EP-1323721-A2 | Organic metal precursor for use in forming metal-containing patterned films | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2003-07-02 | — | — | EP | disclosed |