Diethyl Sulfide

Diethyl Sulfide

SCHEMBL6281872

CCSCC.O=[N+]([O-])[O-].[Ag+]

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Diethyl Sulfide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.44
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
ALDH1A1 P00352 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15147419 0.75
Diethyl Sulfide SCHEMBL11391850 0.73
Alcohol SCHEMBL2689352 0.72
Tetrylammonium SCHEMBL36889 0.69 TSHR (0.57) TSHRMEN1KMT2AALDH1A1
SCHEMBL11333797 0.69 TSHR (0.47) TSHRMEN1KMT2AALDH1A1
Diethyl Sulfide SCHEMBL25414913 0.69
Diethyl Sulfide SCHEMBL2152967 0.69
Diethyl Sulfide SCHEMBL28138832 0.69
Diethyl Sulfide SCHEMBL28201297 0.69
Diethyl Sulfide SCHEMBL27651526 0.69 TSHR (0.32) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6965045-B2 Organic metal precursor for use in forming metal containing patterned films SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-15 US disclosed
US-20030124457-A1 Organic metal precursor for use in forming metal containing patterned films SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-07-03 US disclosed
EP-1323721-A2 Organic metal precursor for use in forming metal-containing patterned films SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-07-02 EP disclosed