SCHEMBL628379

SCHEMBL628379

C=C(C)C(=O)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)O

nearest known ligand 0.63

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.63
TDP1 Q9NUW8 1/20 0.42
ALDH1A1 P00352 2/20 0.39
THRB P10828 1/20 0.38
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2807087 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL2808626 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL9860995 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL63227 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL1174727 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL36607 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL863837 1.00 TSHR (0.63) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL36340 0.98 TSHR (0.66) TSHRTDP1ALDH1A1THRBMAPT
Methoxymethane SCHEMBL4967587 0.95 TSHR (0.61) TSHRTDP1ALDH1A1THRBMAPT
SCHEMBL11664732 0.94 TSHR (0.56) TSHRTDP1ALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2544812-B1 IMPROVED MICROCAPSULES AND PRODUCTION THEREOF FOLLMANN GMBH & CO KG (DE) 2018-10-24 EP claimed
US-12012358-B2 Method of applying coating liquid to an optical fiber CORNING INCORPORATED (US) 2024-06-18 US disclosed
US-11822117-B2 Primary coating compositions with improved microbending performance CORNING INCORPORATED (US) 2023-11-21 US disclosed
EP-3788421-B1 SMALL DIAMETER LOW ATTENUATION OPTICAL FIBER CORNING INC (US) 2023-11-08 EP disclosed
US-20230272143-A1 SURFACE TREATMENT LIQUID AND HYDROPHILIZING TREATMENT METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
WO-2023127934-A1 ENERGY-RAY-CURABLE COMPOSITION FOR THREE-DIMENSIONAL SHAPING USE, DENTAL STRUCTURE, MOUTHPIECE, TEETH-STRAIGHTENING MOUTHPIECE, AND METHOD FOR PRODUCING DENTAL STRUCTURE クラレノリタケデンタル株式会社 2023-07-06 WO disclosed
EP-3722847-B1 LOW DIAMETER OPTICAL FIBER CORNING INC (US) 2023-03-01 EP disclosed
US-20220267495-A1 POLYMERIZABLE COMPOSITION AND HYDROPHILIZING TREATMENT METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-25 US disclosed
WO-2021257813-A1 METHOD OF APPLYING COATING LIQUID TO AN OPTICAL FIBER CORNING INCORPORATED (US) 2021-12-23 WO disclosed
US-20210395143-A1 METHOD OF APPLYING COATING LIQUID TO AN OPTICAL FIBER CORNING INCORPORATED 2021-12-23 US disclosed
EP-0922709-A1 PROCESS FOR PRODUCING (METH)ACRYLATE DERIVATIVES NOF CORPORATION (JP) 1999-06-16 EP disclosed
US-5149776-A CROSS-LINKING HARDENABLE RESIN COMPOSITION, METAL LAMINATES THEREOF AND METAL SURFACE PROCESSING METHOD THEREWITH MITSUBISHI RAYON CO., LTD. (JP) 1992-09-22 US disclosed
EP-0218229-B1 THERMOPLASTIC RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1991-09-25 EP disclosed
EP-0429279-A1 Photocross-linkable resin compositions and their use in the manufacture of dry film resists MITSUBISHI RAYON CO., LTD. (JP) 1991-05-29 EP disclosed
US-4985343-A Crosslinking-curable resin composition MITSUBISHI RAYON CO., LTD. (JP) 1991-01-15 US disclosed
EP-0382524-A2 Crosslinking-curable resin composition MITSUBISHI RAYON CO., LTD. (JP) 1990-08-16 EP disclosed
US-4877688-A HIGH RESOLUTION, HIGH DENSITY MITSUBISHI PAPER MILLS, LTD. (JP) 1989-10-31 US disclosed
US-4740553-A Molding composition containing an elastomer-containing styrene resin, a polycarbonate resin, and a polymer of an acrylate monomer possessing environmental stress cracking resistance DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-04-26 US disclosed
EP-0218229-A2 Thermoplastic resin composition and process for its preparation DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1987-04-15 EP disclosed
US-4170582-A Process for preparing a polymer resin aqueous dispersion DAINIPPON INK AND CHEMICALS, INC. (JP) 1979-10-09 US disclosed