SCHEMBL6286607

SCHEMBL6286607

CCC(C)CCC=Cc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 3/20 0.50
SIGMAR1 Q99720 2/20 0.45
TP53 P04637 1/20 0.41
MAPT P10636 1/20 0.41
IDO1 P14902 2/20 0.40
PAM P19021 1/20 0.40
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
RELA Q04206 1/20 0.38
KDM4E B2RXH2 1/20 0.37
ALDH1A1 P00352 1/20 0.37
GLA P06280 1/20 0.37
GAA P10253 1/20 0.37
HPGD P15428 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL106152 0.82 HTR2A (0.55) HTR2ASIGMAR1TP53MAPTIDO1
SCHEMBL453356 0.82 HTR2A (0.55) HTR2ASIGMAR1TP53MAPTIDO1
SCHEMBL106772 0.81 HTR2A (0.63) HTR2ATP53MAPTIDO1PAM
SCHEMBL106773 0.81 HTR2A (0.63) HTR2ATP53MAPTIDO1PAM
SCHEMBL10521993 0.81 HTR2A (0.46) HTR2ASIGMAR1IDO1PAMMEN1
SCHEMBL10521986 0.81 HTR2A (0.46) HTR2ASIGMAR1IDO1PAMMEN1
SCHEMBL809445 0.79 HTR2A (0.52) HTR2ASIGMAR1IDO1PAMMEN1
SCHEMBL809983 0.79 HTR2A (0.52) HTR2ASIGMAR1IDO1PAMMEN1
SCHEMBL11000399 0.76 HTR2A (0.44) HTR2ASIGMAR1IDO1PAMMEN1
SCHEMBL27816694 0.76 HTR2A (0.49) HTR2ASIGMAR1TP53MAPTIDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114555357-A Metal-clad laminate, wiring board, metal foil with resin, and resin composition 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114423602-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-04-29 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
US-6900273-B1 Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part HITACHI CHEMICAL CO., LTD. (JP) 2005-05-31 US disclosed
US-20040220342-A1 Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part YAMASHITA YUKIHIKO (JP) 2004-11-04 US disclosed
EP-1205517-A1 LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-15 EP disclosed