SCHEMBL6289214

SCHEMBL6289214

CCCC(C)CC=Cc1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 3/20 0.59
GRIK1 P39086 2/20 0.41
GRIK2 Q13002 2/20 0.41
IDO1 P14902 2/20 0.40
PAM P19021 1/20 0.40
NPC1 O15118 1/20 0.39
MTOR P42345 1/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
MAPK1 P28482 1/20 0.39
CYP2C19 P33261 1/20 0.39
HSD17B10 Q99714 1/20 0.39
CTSC P53634 1/20 0.39
CHRNB2 P17787 1/20 0.38
CHRNA7 P36544 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14037582 0.86 HTR2A (0.70) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL106772 0.85 HTR2A (0.63) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL106773 0.85 HTR2A (0.63) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL25189137 0.79 HTR2A (0.61) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL12641605 0.78 HTR2A (0.51) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL29565969 0.78 HTR2A (0.51) HTR2AGRIK1GRIK2PAM
SCHEMBL2170349 0.78 HTR2A (0.70) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL107852 0.78 HTR2A (0.70) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL107851 0.78 HTR2A (0.70) HTR2AGRIK1GRIK2IDO1PAM
SCHEMBL21569429 0.78 HTR2A (0.59) HTR2AGRIK1GRIK2CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114555360-A Copper-clad laminate, wiring board, and resin-attached copper foil 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114555357-A Metal-clad laminate, wiring board, metal foil with resin, and resin composition 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114423602-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-04-29 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
US-6900273-B1 Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part HITACHI CHEMICAL CO., LTD. (JP) 2005-05-31 US disclosed
US-20040220342-A1 Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part YAMASHITA YUKIHIKO (JP) 2004-11-04 US disclosed
EP-1205517-A1 LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-15 EP disclosed