SCHEMBL630013

SCHEMBL630013

[Au].[InH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12003505 0.82
SCHEMBL28542453 0.82
Water SCHEMBL10605761 0.82
SCHEMBL7924340 0.82
SCHEMBL1615456 0.82
SCHEMBL28653783 0.82
Hydrogen Sulfide SCHEMBL2779224 0.82
SCHEMBL629363 0.82
SCHEMBL20815502 0.82
SCHEMBL11294794 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 470 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116033823-B Indium selenide memristor preparation method based on In/Au electrode JIANGNAN UNIVERSITY (CN) 2026-05-26 CN claimed
WO-2025244626-A1 COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING DIAMOND FOUNDRY INCORPORATED (US) 2025-11-27 WO claimed
US-20250357263-A1 COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING DIAMOND FOUNDRY INC (US) 2025-11-20 US claimed
CN-119372728-A Gold indium electroplating process and preparation method thereof 南京科技职业学院 2025-01-28 CN claimed
CN-119170717-A Deep ultraviolet vertical structure LED based on porous structure and preparation method thereof 西安交通大学 2024-12-20 CN claimed
CN-118932483-A Preparation method and application of two-dimensional ErOCl film material 合肥工业大学 2024-11-12 CN claimed
CN-117012708-B Indium column preparation method and infrared detector array interconnection circuit 北京智创芯源科技有限公司 2024-06-11 CN claimed
CN-117542852-A Electronic device and method for manufacturing the same 乐金显示有限公司 2024-02-09 CN claimed
CN-117542850-A Electronic device and method for manufacturing the same 乐金显示有限公司 2024-02-09 CN claimed
CN-117542848-A Electronic device and method for manufacturing the same 乐金显示有限公司 2024-02-09 CN claimed
US-7262444-B2 Power semiconductor packaging method and structure GENERAL ELECTRIC COMPANY (US) 2007-08-28 US claimed
US-7196405-B1 Silicon package with integral heater BLILEY TECHNOLOGIES INC. (US) 2007-03-27 US claimed
US-20070040186-A1 Power semiconductor packaging method and structure GENERAL ELECTRIC COMPANY 2007-02-22 US claimed
US-7061086-B2 Silicon package for piezoelectric device BLILEY TECHNOLOGIES INC. (US) 2006-06-13 US claimed
US-20060043540-A1 Silicon package for piezoelectric device BLILEY TECHNOLOGIES INCORPORATED 2006-03-02 US claimed
CN-2760760-Y Micro photosensitive chip of Hg-Cd-Te infrared photodetector SHANGHAI INST TECH PHYSICS (CN) 2006-02-22 CN claimed
US-6838704-B2 Light emitting diode and method of making the same UNITED EPITAXY CO., LTD. (TW) 2005-01-04 US claimed
US-20040124428-A1 Light emitting diode and method of making the same UNITED EPITAXY CO., LTD. 2004-07-01 US claimed
US-5614727-A Thin film diode having large current capability with low turn-on voltages for integrated devices INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1997-03-25 US claimed
EP-0081419-A2 High lead count hermetic mass bond integrated circuit carrier FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION (US) 1983-06-15 EP claimed