SCHEMBL630060

SCHEMBL630060

OOOCCCCOOO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29750623 0.96
SCHEMBL29750630 0.96
SCHEMBL29750543 0.96
SCHEMBL29750602 0.96
SCHEMBL29750755 0.96
SCHEMBL29750796 0.96
SCHEMBL29750617 0.96
SCHEMBL29750552 0.96
SCHEMBL29750776 0.96
SCHEMBL29750521 0.96

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12371566-B2 Hot-water moldable polyamide molding compositions SOLVAY SPECIALTY POLYMERS USA, LLC (US) 2025-07-29 US disclosed
US-20220213320-A1 HOT-WATER MOLDABLE POLYAMIDE MOLDING COMPOSITIONS SOLVAY SPECIALITY POLYMERS USA, LLC 2022-07-07 US disclosed
EP-1908805-B1 COMPOSITION FOR A HEAT-RESISTANT ANTICORROSION COATING CLOSED JOINT STOCK COMPANY EKA (RU) 2012-02-22 EP disclosed
EP-1908805-A2 COMPOSITION FOR A HEAT-RESISTANT ANTICORROSION COATING Zakritoe Aktsionernoe Obschestvo "EKA" (RU) 2008-04-09 EP disclosed