⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11656984 | 0.76 | — | — | |
| SCHEMBL11656987 | 0.76 | — | — | |
| SCHEMBL2456238 | 0.67 | — | — | |
| SCHEMBL3381714 | 0.64 | — | — | |
| SCHEMBL2500197 | 0.63 | MAPT (0.36) | — | |
| SCHEMBL338605 | 0.62 | — | — | |
| SCHEMBL2502905 | 0.60 | — | — | |
| SCHEMBL66135 | 0.59 | — | — | |
| SCHEMBL16096813 | 0.59 | — | — | |
| SCHEMBL262873 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6866764-B2 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE (US) | 2005-03-15 | — | — | US | claimed |
| US-20030155248-A1 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE | 2003-08-21 | — | — | US | claimed |
| US-5938934-A | METAL ELEMENT OR COMPOUND ADSORBED BY DENDRIMER COMPRISING POLYAMINOAMIDE OR POLYPROPYLENIMINE HYDROPHILLIC CORE RADIALLY LAYERED WITH HYDROPHOBIC OUTER COATING OF CROSSLINKED ORGANOSILICON MATERIAL | DOW CORNING CORPORATION (US) | 1999-08-17 | — | — | US | claimed |
| EP-0928813-A1 | Dendrimer-based nanoscopic sponges and metal composites | DOW CORNING CORPORATION (US) | 1999-07-14 | — | — | EP | claimed |
| US-6866764-B2 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE (US) | 2005-03-15 | — | — | US | disclosed |
| EP-0893482-B1 | Dendrimer-based networks having lyophilic organosilicon and hydrophilic polyamidoamine nanoscopic domains | MICHIGAN MOLECULAR INST (US) | 2004-05-12 | — | — | EP | disclosed |
| US-6617040-B2 | Carbosilane dendramer containing haloalcohol end groups | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY | 2003-09-09 | — | — | US | disclosed |
| US-20030155248-A1 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE | 2003-08-21 | — | — | US | disclosed |
| WO-2003059991-A1 | CHEMOSELECTIVE DENDRIMERIC COMPOUNDS FOR USE IN CHEMICAL SENSORS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2003-07-24 | — | — | WO | disclosed |
| US-20030135005-A1 | Chemoselective dendrimeric compounds for use in chemical sensors | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY | 2003-07-17 | — | — | US | disclosed |
| EP-1184404-A2 | Silicon containing multi-arm star polymers | Dow Corning Corporation (US) | 2002-03-06 | — | — | EP | disclosed |
| US-6350384-B1 | MIXING WATER AND ORGANIC PHASE WITH STAR POLYMERS | DOW CORNING CORPORATION | 2002-02-26 | — | — | US | disclosed |
| US-5938934-A | METAL ELEMENT OR COMPOUND ADSORBED BY DENDRIMER COMPRISING POLYAMINOAMIDE OR POLYPROPYLENIMINE HYDROPHILLIC CORE RADIALLY LAYERED WITH HYDROPHOBIC OUTER COATING OF CROSSLINKED ORGANOSILICON MATERIAL | DOW CORNING CORPORATION (US) | 1999-08-17 | — | — | US | disclosed |
| EP-0928813-A1 | Dendrimer-based nanoscopic sponges and metal composites | DOW CORNING CORPORATION (US) | 1999-07-14 | — | — | EP | disclosed |
| US-5902863-A | HAVING HYDROPHILIC AND HYDROPHOBIC DOMAINS; CONTROLLED SIZE, SHAPE AND DISTRIBUTION; THIN FILMS HAVING OPTICAL CLARITY, TRANSPARENT, COLORLESS AND A NON-STICK SURFACE | DOW CORNING CORPORATION (US) | 1999-05-11 | — | — | US | disclosed |
| EP-0893482-A1 | Dendrimer-based networks having lyophilic organosilicon and hydrophilic polyamidoamine nanoscopic domains | DOW CORNING CORPORATION (US) | 1999-01-27 | — | — | EP | disclosed |
| US-5536732-A | REDUCING INFECTIOUSNESS OF HIV | MERRELL PHARMACEUTICALS INC. (US) | 1996-07-16 | — | — | US | disclosed |
| US-5252587-A | Viricides, aids therapy, antidiabetic agent | MERRELL DOW PHARMACEUTICALS, INC. (US) | 1993-10-12 | — | — | US | disclosed |