⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3419795 | 0.69 | — | — | |
| SCHEMBL2505356 | 0.69 | MEN1 (0.31) | — | |
| SCHEMBL2500045 | 0.66 | MAPT (0.32) | — | |
| SCHEMBL187998 | 0.65 | — | — | |
| SCHEMBL28871011 | 0.64 | TSHR (0.43) | — | |
| SCHEMBL2275530 | 0.60 | — | — | |
| SCHEMBL80580 | 0.60 | — | — | |
| SCHEMBL1029372 | 0.60 | — | — | |
| SCHEMBL8440977 | 0.60 | — | — | |
| SCHEMBL8928349 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6866764-B2 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE (US) | 2005-03-15 | — | — | US | claimed |
| US-20030155248-A1 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE | 2003-08-21 | — | — | US | claimed |
| US-6866764-B2 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE (US) | 2005-03-15 | — | — | US | disclosed |
| US-20030155248-A1 | Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings | MICHIGAN MOLECULAR INSTITUTE | 2003-08-21 | — | — | US | disclosed |