⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL150800 | 0.82 | — | — | |
| SCHEMBL5354949 | 0.82 | — | — | |
| SCHEMBL30377692 | 0.80 | — | — | |
| SCHEMBL10595615 | 0.80 | — | — | |
| SCHEMBL742678 | 0.80 | — | — | |
| SCHEMBL2979551 | 0.80 | — | — | |
| SCHEMBL1756777 | 0.80 | — | — | |
| Charcoal, Activated SCHEMBL30544835 | 0.78 | — | — | |
| SCHEMBL30683818 | 0.78 | — | — | |
| SCHEMBL28251324 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210017650-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT CO.,LTD. (KR) | 2021-01-21 | — | — | US | claimed |
| EP-3760761-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT Co. Ltd. (KR) | 2021-01-06 | — | — | EP | claimed |
| US-20240260200-A1 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | YMT CO., LTD. (KR) | 2024-08-01 | — | — | US | disclosed |
| EP-4329437-A1 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | YMT Co., Ltd. (KR) | 2024-02-28 | — | — | EP | disclosed |
| WO-2023239194-A1 | METAL LAYER, CARRIER-ATTACHED METAL FOIL COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME | 와이엠티 주식회사 | 2023-12-14 | — | — | WO | disclosed |
| WO-2023219190-A1 | COMPOSITE RELEASE LAYER FOR CARRIER-ATTACHED METAL FOIL AND METAL FOIL COMPRISING SAME | 와이엠티 주식회사 | 2023-11-16 | — | — | WO | disclosed |
| WO-2023096314-A1 | METHOD FOR FORMING CIRCUIT PATTERN ON SUBSTRATE BY USING METAL FOIL WITH LOW SURFACE ROUGHNESS | 와이엠티 주식회사 | 2023-06-01 | — | — | WO | disclosed |
| WO-2023277462-A1 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | 와이엠티 주식회사 | 2023-01-05 | — | — | WO | disclosed |
| US-11499233-B2 | Plated laminate and printed circuit board | YMT CO., LTD. (KR) | 2022-11-15 | — | — | US | disclosed |
| WO-2022124842-A1 | METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME | 와이엠티 주식회사 | 2022-06-16 | — | — | WO | disclosed |
| WO-2022124843-A1 | RELEASE LAYER FOR METAL FOIL WITH CARRIER, AND METAL FOIL COMPRISING SAME | 와이엠티 주식회사 | 2022-06-16 | — | — | WO | disclosed |
| US-7501014-B2 | Formaldehyde free electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-03-10 | — | — | US | disclosed |
| US-20080038451-A1 | Formaldehyde free electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038449-A1 | Electroless copper and redox couples | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038450-A1 | Environmentally friendly electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038452-A1 | Electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| EP-1876259-A2 | Formaldehyde free electrolesss copper compositions | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876260-A2 | Improved electroless copper compositions | Rohm and Haas Electronic Materials LLC (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876261-A1 | Electroless copper and redox couples | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876262-A1 | Environmentally friendly electroless copper compositions | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |