SCHEMBL633175

SCHEMBL633175

CC1CCC(C(=O)O)(C(=O)OC(=O)C2(C(=O)O)CCC(C)CC2)CC1

nearest known ligand 0.36

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33
CYP1A2 P05177 1/20 0.32
FFAR3 O14843 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4006703 0.86 NPSR1 (0.34) CYP2C9CYP2C19CYP1A2FFAR3
SCHEMBL3420703 0.84 CYP2C19 (0.38) CYP2C9CYP2C19CYP1A2FFAR3
SCHEMBL28858898 0.82 CYP2C19 (0.37) CYP2C9CYP2C19CYP1A2FFAR3
Cyclohexane SCHEMBL4651983 0.80 CYP1A2 (0.38) CYP2C9CYP2C19CYP1A2FFAR3
SCHEMBL11758545 0.79 FFAR3 (0.35) FFAR3
SCHEMBL8173774 0.79 GRM2 (0.42) CYP2C19CYP1A2
SCHEMBL8174277 0.77 TP53 (0.39) CYP1A2
SCHEMBL632817 0.77 CYP1A2 (0.46) CYP1A2
SCHEMBL8179932 0.76 GRM2 (0.32) CYP2C19CYP1A2
SCHEMBL5476177 0.76 CYP1A2 (0.42) CYP2C9CYP2C19CYP1A2FFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090163652-A1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF CHISSO CORPORATION (JP) 2009-06-25 US claimed
US-20240240059-A1 EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION OTSUKA CHEMICAL CO., LTD. (JP) 2024-07-18 US disclosed
WO-2023276702-A1 EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION 大塚化学株式会社 2023-01-05 WO disclosed
CN-114933725-A Carbon fiber/epoxy resin-based structure super capacitor and preparation method thereof 上海墨浦科技有限公司 2022-08-23 CN disclosed
US-10954340-B2 Polyimide precursor composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-23 US disclosed
US-20200377652-A1 HIGH MOLECULAR WEIGHT POLYOXYALKYLENE WITH LOW GLASS TRANSITION TEMPERATURE, PRODUCED BY THE GRAFTING THROUGH METHOD COVESTRO DEUTSCHLAND AG (DE) 2020-12-03 US disclosed
CN-111386297-A High molecular weight polyoxyalkylenes with low glass transition temperatures produced by macromer process 科思创德国股份有限公司 2020-07-07 CN disclosed
US-20190185711-A1 EPOXY RESIN COMPOSITION AND CURED RESIN FILM WITH LOW CURING SHRINKAGE AND EXCELLENT ADHESION JNC CORPORATION (JP) 2019-06-20 US disclosed
EP-3330320-B1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-04-24 EP disclosed
US-20180223045-A1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-08-09 US disclosed
EP-3330320-A1 POLYIMIDE PRECURSOR COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-06-06 EP disclosed
US-9753186-B2 Glass fiber-silsesquioxane composite molded article and method for producing same JNC CORPORATION (JP) 2017-09-05 US disclosed
EP-2420529-B1 GLASS FIBER-SILSESQUIOXANE COMPOSITE MOLDED ARTICLE AND METHOD FOR PRODUCING SAME JNC CORP (JP) 2016-10-26 EP disclosed
US-8273843-B2 Organosilicon compound and thermosetting resin composition containing the same JNC CORPORATION (JP) 2012-09-25 US disclosed
US-20120052296-A1 GLASS FIBER-SILSESQUIOXANE COMPOSITE MOLDED ARTICLE AND METHOD FOR PRODUCING SAME JNC CORPORATION (JP) 2012-03-01 US disclosed
EP-2420529-A1 GLASS FIBER-SILSESQUIOXANE COMPOSITE MOLDED ARTICLE AND METHOD FOR PRODUCING SAME JNC Corporation (JP) 2012-02-22 EP disclosed
US-20100273937-A1 ORGANOSILICON COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME CHISSO CORPORATION (JP) 2010-10-28 US disclosed
US-20090163652-A1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF CHISSO CORPORATION (JP) 2009-06-25 US disclosed
US-6468659-B1 TWO COMPONENTS WHICH CAN BE STORED SEPARATELY AND CROSSLINKED WITH ANOTHER AT ROOM TEMPERATURE; A GLYCIDYLAMINE COMPOUND AND AN ANHYDRIDE;PREFERABLY WITHOUT USING A CURING ACCELERATOR. ABB SCHWEIZ AG (CH) 2002-10-22 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100273937-A1 ORGANOSILICON COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME OR51E2, STS, OXER1 CYP2C9 868/4885CYP2C19 784/4885CYP1A2 1174/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.