⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16153792 | 0.92 | — | — | |
| SCHEMBL14870865 | 0.91 | — | — | |
| SCHEMBL6354308 | 0.89 | — | — | |
| SCHEMBL14870856 | 0.89 | — | — | |
| SCHEMBL14870860 | 0.88 | — | — | |
| SCHEMBL98786 | 0.87 | — | — | |
| SCHEMBL26538475 | 0.87 | — | — | |
| SCHEMBL6353065 | 0.87 | — | — | |
| SCHEMBL7009379 | 0.87 | — | — | |
| SCHEMBL7009729 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9890233-B2 | Resist composition, method of forming resist pattern, and polymeric compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-02-13 | — | — | US | disclosed |
| US-9507258-B2 | Resin and photoresist composition comprising the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2016-11-29 | — | — | US | disclosed |
| US-9233945-B2 | Compound, resin and photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2016-01-12 | — | — | US | disclosed |
| US-20150198880-A1 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-07-16 | — | — | US | disclosed |
| US-20130095424-A1 | COMPOUND, RESIN AND PHOTORESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-04-18 | — | — | US | disclosed |
| US-8268529-B2 | Positive resist composition, method of forming resist pattern using the same, and polymeric compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-09-18 | — | — | US | disclosed |
| US-8232041-B2 | Positive resist composition, method of forming resist pattern, and polymeric compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-07-31 | — | — | US | disclosed |
| US-8227170-B2 | Resist composition, method of forming resist pattern, polymeric compound, and compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-07-24 | — | — | US | disclosed |
| US-20120115082-A1 | RESIN AND PHOTORESIST COMPOSITION COMPRISING THE SAME | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-05-10 | — | — | US | disclosed |
| US-20100209848-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-08-19 | — | — | US | disclosed |
| US-20100196821-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100178609-A1 | RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |