SCHEMBL6357100

SCHEMBL6357100

O=C1CCCC(C(F)(F)F)O1

nearest known ligand 0.41

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.41
CA9 Q16790 2/20 0.41
NOS3 P29474 1/20 0.31
NOS1 P29475 1/20 0.31
NOS2 P35228 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6346884 0.94 CA1 (0.40) CA1CA9SMN1; SMN2
SCHEMBL12182879 0.86 CA1 (0.44) CA1CA9
SCHEMBL8467907 0.82 CA1 (0.32) CA1CA9
SCHEMBL8467910 0.82 CA1 (0.32) CA1CA9
SCHEMBL8467906 0.82 CA1 (0.32) CA1CA9
SCHEMBL13817904 0.78 CA1 (0.46) CA1CA9SMN1; SMN2CYP2D6
SCHEMBL13533896 0.78 CA1 (0.46) CA1CA9SMN1; SMN2CYP2D6
SCHEMBL538695 0.70
SCHEMBL18268911 0.70
SCHEMBL15260278 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed