⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26910502 | 1.00 | — | — | |
| SCHEMBL28192117 | 0.85 | — | — | |
| SCHEMBL1847666 | 0.82 | — | — | |
| SCHEMBL814168 | 0.75 | — | — | |
| SCHEMBL577292 | 0.66 | — | — | |
| SCHEMBL10267910 | 0.65 | — | — | |
| SCHEMBL1937614 | 0.65 | — | — | |
| SCHEMBL14946387 | 0.64 | — | — | |
| SCHEMBL17087756 | 0.63 | — | — | |
| SCHEMBL10325369 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20050173011-A1 | Multi-layer tubing having electrostatic dissipation for handling hydrocarbon fluids | ITT INDUSTRIES, INC. (US) | 2005-08-11 | — | — | US | claimed |
| EP-1053427-B1 | MULTI-LAYER TUBING HAVING AT LEAST ONE INTERMEDIATE LAYER FORMED FROM A POLYAMIDE ALLOY | ITT MFG ENTERPRISES INC (US) | 2003-11-05 | — | — | EP | claimed |
| US-6257281-B1 | FORM MOTOR VEHICLES | ITT MANUFACTURING ENTERPRISES, INC. | 2001-07-10 | — | — | US | claimed |
| EP-1053427-A1 | MULTI-LAYER TUBING HAVING AT LEAST ONE INTERMEDIATE LAYER FORMED FROM A POLYAMIDE ALLOY | ITT MANUFACTURING ENTERPRISES, INC. (US) | 2000-11-22 | — | — | EP | claimed |
| WO-1999041538-A1 | MULTI-LAYER TUBING HAVING AT LEAST ONE INTERMEDIATE LAYER FORMED FROM A POLYAMIDE ALLOY | ITT MANUFACTURING ENTERPRISES, INC. (US) | 1999-08-19 | — | — | WO | claimed |
| EP-4228101-A1 | ASSEMBLY FOR CREATING A FLAMEPROOF OR EXPLOSION PROOF BARRIER | Micro Motion, Inc. (US) | 2023-08-16 | — | — | EP | disclosed |
| EP-4228102-A1 | ASSEMBLIES AND METHODS FOR CREATING A FLAMEPROOF OR EXPLOSION PROOF BARRIER | Micro Motion, Inc. (US) | 2023-08-16 | — | — | EP | disclosed |
| US-20230083693-A1 | ASSEMBLIES, COMPONENTS, AND METHODS FOR CREATING A FLAMEPROOF OR EXPLOSION PROOF BARRIER | MICRO MOTION, INC. (US) | 2023-03-16 | — | — | US | disclosed |
| EP-4107819-A1 | ASSEMBLIES, COMPONENTS, AND METHODS FOR CREATING A FLAMEPROOF OR EXPLOSION PROOF BARRIER | Micro Motion, Inc. (US) | 2022-12-28 | — | — | EP | disclosed |
| CN-115136422-A | Assembly, component and method for forming a fire or explosion protection barrier | 高准有限公司 | 2022-09-30 | — | — | CN | disclosed |
| CN-106233436-B | Method for increasing etching rate of silicon etching process by etching chamber pretreatment | 国际商业机器公司 | 2020-01-07 | — | — | CN | disclosed |
| US-9711365-B2 | Etch rate enhancement for a silicon etch process through etch chamber pretreatment | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-07-18 | — | — | US | disclosed |
| CN-106233436-A | The method being improved the etch-rate of silicon etch process by etched cavity pretreatment | 国际商业机器公司 | 2016-12-14 | — | — | CN | disclosed |
| US-20150318182-A1 | ETCH RATE ENHANCEMENT FOR A SILICON ETCH PROCESS THROUH ETCH CHAMBER PRETREATMENT | ZEON CORPORATION (JP) | 2015-11-05 | — | — | US | disclosed |
| US-8928124-B2 | High aspect ratio and reduced undercut trench etch process for a semiconductor substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-01-06 | — | — | US | disclosed |
| US-8652969-B2 | High aspect ratio and reduced undercut trench etch process for a semiconductor substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-02-18 | — | — | US | disclosed |
| US-20130328173-A1 | HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SEMICONDUCTOR SUBSTRATE | ZEON CORPORATION (JP) | 2013-12-12 | — | — | US | disclosed |
| US-20130105947-A1 | HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SEMICONDUCTOR SUBSTRATE | ZEON CORPORATION (JP) | 2013-05-02 | — | — | US | disclosed |
| US-6318603-B1 | Valve for aerosol container | SMITHKLINE BEECHAM CORPORATION | 2001-11-20 | — | — | US | disclosed |