SCHEMBL6368176

SCHEMBL6368176

Cc1ccc(Cc2nc3ccccc3[nH]2)c(C)c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.58
NPC1 O15118 3/20 0.58
RAB9A P51151 3/20 0.58
SMN1; SMN2 Q16637 3/20 0.58
EGFR P00533 2/20 0.56
PKM P14618 2/20 0.55
LMNA P02545 1/20 0.55
MAPT P10636 1/20 0.55
HTT P42858 1/20 0.55
HKDC1 Q2TB90 1/20 0.55
DDAH1 O94760 1/20 0.53
ALDH1A1 P00352 2/20 0.52
HPGD P15428 1/20 0.52
KRAS P01116 1/20 0.52
POLB P06746 1/20 0.52
MEN1 O00255 1/20 0.51
THRB P10828 1/20 0.51
KMT2A Q03164 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
CFB P00751 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4119398 0.84 EGFR (0.74) GAANPC1RAB9AEGFRPKM
SCHEMBL6368090 0.82 CFB (0.64) GAANPC1RAB9ASMN1; SMN2EGFR
SCHEMBL29823043 0.80 GAA (0.77) GAANPC1RAB9ASMN1; SMN2EGFR
SCHEMBL22356617 0.80 GAA (0.77) GAANPC1RAB9ASMN1; SMN2EGFR
SCHEMBL6368172 0.78 EGFR (0.65) GAANPC1RAB9AEGFRPKM
SCHEMBL230024 0.77 GAA (0.78) GAANPC1RAB9ASMN1; SMN2EGFR
Iodomethane SCHEMBL27491515 0.76 GAA (0.70) GAANPC1RAB9APKMLMNA
SCHEMBL8974018 0.75 KMT2A (0.58) NPC1RAB9ASMN1; SMN2PKMMAPT
SCHEMBL11352888 0.74 EGFR (0.58) GAANPC1RAB9ASMN1; SMN2EGFR
SCHEMBL25735980 0.74 KRAS (0.60) GAANPC1RAB9ASMN1; SMN2PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-20050173678-A1 Surface treatment agents for metal films of printed circuit boards TAMURA KAKEN CORPORATION (JP) 2005-08-11 US disclosed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed