Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CD81 | P60033 | 2/20 | 0.36 |
| ▸ | EP300 | Q09472 | 1/20 | 0.35 |
| ▸ | KISS1R | Q969F8 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | TBXAS1 | P24557 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | KDM4A | O75164 | 1/20 | 0.33 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.33 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.32 |
| ▸ | BACE1 | P56817 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL637283 | 1.00 | CD81 (0.36) | CD81EP300KISS1RKDM4EALDH1A1 | |
| SCHEMBL17423959 | 0.94 | EP300 (0.38) | CD81EP300KISS1RKDM4EALDH1A1 | |
| SCHEMBL4337785 | 0.92 | EP300 (0.41) | CD81EP300KDM4ETBXAS1KDM4A | |
| SCHEMBL4334367 | 0.92 | EP300 (0.41) | CD81EP300KDM4ETBXAS1KDM4A | |
| SCHEMBL637565 | 0.87 | CD81 (0.38) | CD81KDM4EALDH1A1TBXAS1PTGS1 | |
| SCHEMBL337281 | 0.87 | CD81 (0.38) | CD81KDM4EALDH1A1TBXAS1PTGS1 | |
| Hydrochloric Acid SCHEMBL9844191 | 0.85 | CD81 (0.37) | CD81KDM4AKDM4CPTGS1PPARG | |
| SCHEMBL4497690 | 0.83 | CD81 (0.39) | CD81EP300TBXAS1PPARGBACE1 | |
| SCHEMBL1317424 | 0.82 | EP300 (0.48) | CD81EP300TBXAS1PTGS1PPARG | |
| SCHEMBL11211538 | 0.82 | EP300 (0.43) | CD81EP300KDM4ETBXAS1PTGS1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4076916-B1 | WETTABLE SILICONE HYDROGEL CONTACT LENSES | ALCON INC (CH) | 2024-06-12 | — | — | EP | claimed |
| US-8568873-B2 | Pressure-sensitive adhesive for polarizing plates, polarizing plate with pressure-sensitive adhesive and production process for the same | LINTEC CORPORATION (JP) | 2013-10-29 | — | — | US | claimed |
| US-7291372-B2 | Release process film | LINTEC CORPORATION (JP) | 2007-11-06 | — | — | US | claimed |
| US-20070009733-A1 | Adhesive optical component comprising an adhesive composition | LINTEC CORPORATION (JP) | 2007-01-11 | — | — | US | claimed |
| US-6720375-B2 | MIXTURE OF (METH)ACRYLATE ESTER, CROSSLINKING AGENT AND PHENOLIC COMPOUND | LINTEC CORPORATION (JP) | 2004-04-13 | — | — | US | claimed |
| WO-2003092913-A1 | INK-JET COATING COMPOSITIONS, PROCESS FOR MAKING, AND USE IN PROVIDING WATER-RESISTANT IMAGE | PIXTERRA, INC. (US) | 2003-11-13 | — | — | WO | claimed |
| EP-4067999-B1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-4063954-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-4067999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-10-05 | — | — | EP | disclosed |
| EP-3951499-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-02-09 | — | — | EP | disclosed |
| EP-3951498-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-02-09 | — | — | EP | disclosed |
| WO-2022004197-A1 | METHOD FOR MANUFACTURING ABRASIVE GRAINS, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR CHEMICAL MECHANICAL POLISHING | JSR株式会社 | 2022-01-06 | — | — | WO | disclosed |
| EP-2605853-B1 | PROCESS FOR IMPROVING THE STORAGE STABILITY OF AQUEOUS COMPOSITE PARTICLE DISPERSIONS | BASF SE (DE) | 2017-04-19 | — | — | EP | disclosed |
| US-20050148733-A1 | Adhesive composition, adhesive sheet and adhesive optical component | LINTEC CORPORATION (JP) | 2005-07-07 | — | — | US | disclosed |
| EP-1235869-B1 | METHOD FOR PRODUCING AN AQUEOUS DISPERSION OF PARTICLES THAT ARE MADE UP OF POLYMERS AND INORGANIC SOLID MATTER WHICH CONSISTS OF FINE PARTICLES | BASF AG (DE) | 2004-12-01 | — | — | EP | disclosed |
| EP-1474491-A1 | USE OF ANTI-ADHESIVE PACKAGING MATERIALS FOR PACKAGING CHEMICALS AND FOOD | BASF AKTIENGESELLSCHAFT (DE) | 2004-11-10 | — | — | EP | disclosed |
| WO-2004092481-A2 | METHOD FOR THE TREATMENT OF PAPER SURFACES | BASF AKTIENGESELLSCHAFT (DE) | 2004-10-28 | — | — | WO | disclosed |
| EP-1431356-A2 | Use of aqueous dipersion of particles made up of polymerisate and fine inorganic solid material for priming mineral substrates | Basf AG (DE) | 2004-06-23 | — | — | EP | disclosed |
| WO-2003066763-A1 | USE OF ANTI-ADHESIVE PACKAGING MATERIALS FOR PACKAGING CHEMICALS AND FOOD | BASF AKTIENGESELLSCHAFT (DE) | 2003-08-14 | — | — | WO | disclosed |
| EP-0428970-A1 | Process for preparing aqueous solutions or suspensions of quaternization products of tertiary aminoalkylesters or tertiary aminoalkylamides of acrylic or methacrylic acid, for instance of dimethylaminoethyl-acrylate-methochloride | BASF Aktiengesellschaft (DE) | 1991-05-29 | — | — | EP | disclosed |