SCHEMBL6375418

SCHEMBL6375418

C=CCC.C=CCC(C)C

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.33
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene SCHEMBL1796636 0.97 TSHR (0.32) TSHR
SCHEMBL21208 0.90
SCHEMBL10928194 0.87 TSHR (0.57) TSHRALDH1A1
SCHEMBL9655461 0.87
Ammonia Solution, Strong SCHEMBL2430803 0.87
Ammonia Solution, Strong SCHEMBL8388110 0.87
Ethylene SCHEMBL1072149 0.87
Propene SCHEMBL3794853 0.84
SCHEMBL2521635 0.80 TSHR (0.63) TSHRALDH1A1
Heptane SCHEMBL9773409 0.80 TSHR (0.52) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 267 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111286110-B High-comfort shock-absorption foaming midsole material, preparation method thereof and sports shoes 安踏(中国)有限公司 2022-09-23 CN claimed
CN-112662043-A Preparation and implementation method of impact force protection foaming shoe material 郑忠利 2021-04-16 CN claimed
CN-111286110-A High-comfort cushioning foaming insole material, preparation method thereof and sports shoes 安踏(中国)有限公司 2020-06-16 CN claimed
EP-4049550-B1 CUSHIONING STRUCTURE, SHOE SOLE, AND SHOE ASICS CORP (JP) 2024-07-03 EP disclosed
EP-4212054-B1 SHOE SOLE AND SHOE ASICS CORP (JP) 2024-06-26 EP disclosed
EP-4388915-A1 SOLE AND SHOE ASICS Corporation (JP) 2024-06-26 EP disclosed
EP-4379849-A2 ALL-SOLID SECONDARY BATTERY Samsung SDI Co., Ltd (KR) 2024-06-05 EP disclosed
CN-118119316-A Sole and shoes 株式会社爱世克私 2024-05-31 CN disclosed
US-20240178443-A1 ALL-SOLID SECONDARY BATTERY SAMSUNG SDI CO., LTD. (KR) 2024-05-30 US disclosed
WO-2024112125-A1 ALL-SOLID-STATE SECONDARY BATTERY 삼성에스디아이주식회사 2024-05-30 WO disclosed
US-20240122295-A1 FOOTWEAR ASICS CORPORATION (JP) 2024-04-18 US disclosed
EP-0802804-A1 BIODEGRADABLE ARTICLES MADE FROM CERTAIN TRANS-POLYMERS AND BLENDS THEREOF WITH OTHER BIODEGRADABLE COMPONENTS THE PROCTER & GAMBLE COMPANY (US) 1997-10-29 EP disclosed
WO-1996021475-A1 BIODEGRADABLE ARTICLES MADE FROM CERTAIN TRANS-POLYMERS AND BLENDS THEREOF WITH OTHER BIODEGRADABLE COMPONENTS THE PROCTER & GAMBLE COMPANY (US) 1996-07-18 WO disclosed
EP-0370094-B1 THERMOPLASTIC MATERIAL CONTAINING ABSORBENT PAD OR OTHER ARTICLE ABSORBENT PRODUCTS INC (US) 1994-12-28 EP disclosed
EP-0370087-A4 METHOD OF MAKING A PAD OR OTHER ARTICLE 1991-12-27 EP disclosed
EP-0370094-A4 THERMOPLASTIC MATERIAL CONTAINING ABSORBENT PAD OR OTHER ARTICLE 1990-11-28 EP disclosed
EP-0370094-A1 THERMOPLASTIC MATERIAL CONTAINING ABSORBENT PAD OR OTHER ARTICLE. WEYERHAEUSER CO (US) 1990-05-30 EP disclosed
EP-0370087-A1 METHOD OF MAKING A PAD OR OTHER ARTICLE ABSORBENT PRODUCTS, INC. (US) 1990-05-30 EP disclosed
WO-1989010084-A1 THERMOPLASTIC MATERIAL CONTAINING ABSORBENT PAD OR OTHER ARTICLE WEYERHAEUSER COMPANY (US) 1989-11-02 WO disclosed
WO-1989010109-A1 METHOD OF MAKING A PAD OR OTHER ARTICLE WEYERHAEUSER COMPANY (US) 1989-11-02 WO disclosed