SCHEMBL637801

SCHEMBL637801

O=C(O)CC(S)C(=O)O.[KH]

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 2/20 0.52
TDP1 Q9NUW8 3/20 0.48
RNPEP Q9H4A4 3/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
SLC22A6 Q4U2R8 1/20 0.43
HPGD P15428 2/20 0.40
HSD17B10 Q99714 2/20 0.40
LMNA P02545 2/20 0.40
ABCB11 O95342 1/20 0.40
F2 P00734 1/20 0.40
KDM4E B2RXH2 1/20 0.40
MEN1 O00255 1/20 0.40
ALDH1A1 P00352 1/20 0.40
MAPT P10636 1/20 0.40
ALOX15 P16050 1/20 0.40
KMT2A Q03164 1/20 0.40
DUSP3 P51452 1/20 0.40
PTPN5 P54829 1/20 0.40
PTPN11 Q06124 1/20 0.40
CYP2C9 P11712 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL133541 0.97
SCHEMBL2103664 0.97
SCHEMBL7899825 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
Lithium SCHEMBL31092059 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL29217089 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL11410952 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL1546190 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL11582606 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL637786 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6
SCHEMBL29199235 0.94 FOLH1 (0.52) FOLH1TDP1RNPEPSMN1; SMN2SLC22A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020045454-A1 RUBBER COMPOSITION, METAL-RUBBER COMPOSITE MOLDED BODY AND METHOD FOR PRODUCING METAL-RUBBER COMPOSITE MOLDED BODY 住友化学株式会社 2020-03-05 WO disclosed
US-8940088-B2 Aqueous ink composition and recorded article formed by using the same SEIKO EPSON CORPORATION (JP) 2015-01-27 US disclosed
US-8574356-B2 Ink composition and recording method SEIKO EPSON CORPORATION (JP) 2013-11-05 US disclosed
US-8119034-B2 Conductive pattern forming ink, conductive pattern, and wiring substrate SEIKO EPSON CORPORATION (JP) 2012-02-21 US disclosed
US-8119036-B2 Conductive pattern forming ink, conductive pattern, and wiring substrate SEIKO EPSON CORPORATION (JP) 2012-02-21 US disclosed
US-8119035-B2 Conductive pattern forming ink, conductive pattern, and wiring substrate SEIKO EPSON CORPORATION (JP) 2012-02-21 US disclosed
CN-101691087-B Filling liquid SEIKO EPSON CORP. (JP) 2011-12-14 CN disclosed
US-8066912-B2 Conductive pattern forming ink, conductive pattern, and wiring substrate SEIKO EPSON CORPORATION (JP) 2011-11-29 US disclosed
US-20110281032-A1 INK COMPOSTION AND RECORDING METHOD SEIKO EPSON CORPORATION (JP) 2011-11-17 US disclosed
US-20110281089-A1 AQUEOUS INK COMPOSITION AND RECORDED ARTICLE FORMED BY USING THE SAME SEIKO EPSON CORPORATION (JP) 2011-11-17 US disclosed
US-7988886-B2 Conductive pattern forming ink, conductive pattern and wiring substrate SEIKO EPSON CORPORATION (JP) 2011-08-02 US disclosed
US-7988888-B2 Conductive pattern forming ink, conductive pattern, and wiring substrate SEIKO EPSON CORPORATION (JP) 2011-08-02 US disclosed
CN-101691087-A Filling liquid SEIKO EPSON CORP 2010-04-07 CN disclosed
US-20090148676-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090148671-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090146113-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090145639-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090148680-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090148679-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed
US-20090146114-A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE SEIKO EPSON CORPORATION (JP) 2009-06-11 US disclosed