⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3372973 | 0.69 | — | — | |
| SCHEMBL13994022 | 0.69 | — | — | |
| SCHEMBL2429166 | 0.65 | — | — | |
| SCHEMBL2429169 | 0.65 | — | — | |
| SCHEMBL15944882 | 0.65 | — | — | |
| SCHEMBL41219 | 0.62 | — | — | |
| SCHEMBL41218 | 0.62 | — | — | |
| SCHEMBL160149 | 0.62 | — | — | |
| SCHEMBL4968993 | 0.61 | — | — | |
| SCHEMBL5183762 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 134 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7435364-B2 | Method for forming a porous polishing pad | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2008-10-14 | — | — | US | claimed |
| US-20080063856-A1 | Water-based polishing pads having improved contact area | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2008-03-13 | — | — | US | claimed |
| US-7275928-B2 | Apparatus for forming a striation reduced chemical mechanical polishing pad | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2007-10-02 | — | — | US | claimed |
| US-20070141312-A1 | Multilayered polishing pads having improved defectivity and methods of manufacture | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2007-06-21 | — | — | US | claimed |
| US-20070066195-A1 | Water-based polishing pads having improved adhesion properties and methods of manufacture | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2007-03-22 | — | — | US | claimed |
| US-20060226567-A1 | Curing polymeric matrix with fluid-filled unexpanded microspheres, heating the polymeric matrix and the microspheres to expand the microspheres | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2006-10-12 | — | — | US | claimed |
| US-20060226568-A1 | Method for forming a porous reaction injection molded chemical mechanical polishing pad | JAMES DAVID B | 2006-10-12 | — | — | US | claimed |
| US-20060202384-A1 | Water-based polishing pads and methods of manufacture | DUONG CHAU H | 2006-09-14 | — | — | US | claimed |
| US-20060110488-A1 | Apparatus for forming a striation reduced chemical mechanical polishing pad | DuPont Electronic Materials Holding, Inc. | 2006-05-25 | — | — | US | claimed |
| US-20060108701-A1 | Method for forming a striation reduced chemical mechanical polishing pad | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2006-05-25 | — | — | US | claimed |
| US-20060067160-A1 | Apparatus for forming a polishing pad having a reduced striations | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2006-03-30 | — | — | US | claimed |
| US-20060066001-A1 | Method of forming a polishing pad having reduced striations | DuPont Electronic Materials Holding, Inc. | 2006-03-30 | — | — | US | claimed |
| US-20030068960-A1 | A polymeric matrix and a dissolvable substance for polishing a semiconductor device. | REINHARDT HEINZ F (US) | 2003-04-10 | — | — | US | claimed |
| JP-3013105-B2 | — | — | 2000-02-28 | — | — | JP | claimed |
| US-5578362-A | WHICH ARE FLEXIBLE, HAVING A WORK SURFACE AND SUBSURFACE PROXIMATE TO IT; SEMICONDUCTORS | RODEL, INC. (US) | 1996-11-26 | — | — | US | claimed |
| EP-0656031-A4 | POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS. | RODEL INC (US) | 1995-07-26 | — | — | EP | claimed |
| EP-0656031-A1 | POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS | Rodel, Inc. (US) | 1995-06-07 | — | — | EP | claimed |
| WO-1994004599-A1 | POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS | RODEL, INC. (US) | 1994-03-03 | — | — | WO | claimed |
| US-12023853-B2 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | APPLIED MATERIALS, INC. (US) | 2024-07-02 | — | — | US | disclosed |
| WO-1994004599-A1 | POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS | RODEL, INC. (US) | 1994-03-03 | — | — | WO | disclosed |