SCHEMBL642401

SCHEMBL642401

[CH2]C(C)OC[CH]C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1804157 0.83
SCHEMBL8472131 0.81
SCHEMBL8472635 0.81
SCHEMBL11733793 0.78
SCHEMBL7196873 0.78
SCHEMBL910603 0.77
SCHEMBL911000 0.75
SCHEMBL19717979 0.71
SCHEMBL896453 0.69
SCHEMBL8744954 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 417 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3730532-B1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO LTD (CN) 2022-02-23 EP claimed
CN-111825947-B Resin composition for metal substrate, resin glue solution containing resin composition and metal-based copper-clad laminate 广东生益科技股份有限公司 2021-08-27 CN claimed
WO-2020215399-A1 RESIN COMPOSITION FOR METAL SUBSTRATE, RESIN GLUE SOLUTION COMPRISING SAME, AND METAL-BASED COPPER FOIL-CLAD LAMINATE 广东生益科技股份有限公司 2020-10-29 WO claimed
EP-3730532-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME Shengyi Technology Co., Ltd. (CN) 2020-10-28 EP claimed
CN-111825947-A Resin composition for metal substrate, resin glue solution containing resin composition and metal-based copper-clad laminate 广东生益科技股份有限公司 2020-10-27 CN claimed
US-20200332109-A1 RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2020-10-22 US claimed
CN-103788025-B A kind of method of refining propylene oxide SINOPEC CORP. (CN) 2015-10-28 CN claimed
EP-2022812-B1 POLYETHER-MODIFIED ORGANOPOLYSILOXANE, DIORGANOPOLYSILOXANE-POLYETHER BLOCK COPOLYMER, THEIR PRODUCTION METHODS, AND COSMETIC PREPARATION DOW CORNING TORAY CO LTD (JP) 2014-04-23 EP claimed
US-8034891-B2 Polyether-modified organopolysiloxane, diorganopolysiloxane-polyether block copolymer, their production methods, and cosmetic preparation DOW CORNING TORAY COMPANY, LTD. (JP) 2011-10-11 US claimed
US-20100036062-A1 Polyether-Modified Organopolysiloxane, Diorganopolysiloxane-Polyether Block Copolymer, Their Production Methods, and Cosmetic Preparation DOW TORAY CO., LTD. (JP) 2010-02-11 US claimed
EP-1131370-A1 HYDROXY-FUNCTIONALIZED POLY(AMINO ETHER) SALTS THE DOW CHEMICAL COMPANY (US) 2001-09-12 EP claimed
WO-2000020484-A1 HYDROXY-FUNCTIONALIZED POLY(AMINO ETHER) SALTS THE DOW CHEMICAL COMPANY (US) 2000-04-13 WO claimed
US-5880227-A Curable oil-and water-repellent silicone composition DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-03-09 US claimed
US-5834078-A Hydroxy-functionalized poly(amino ether) salts THE DOW CHEMICAL COMPANY (US) 1998-11-10 US claimed
US-5777052-A Silicone modified vinyl polymers and method for the preparation thereof DOW CORNING TORAY SLICONE CO., LTD. (JP) 1998-07-07 US claimed
EP-0757081-A2 Curable oil- and water-repellent silicone composition Dow Corning Toray Silicone Company Ltd. (JP) 1997-02-05 EP claimed
US-5552254-A Amic acid based toner compositions XEROX CORPORATION (US) 1996-09-03 US claimed
US-5512401-A MIXED WITH PIGMENT; ELECTROGRAPHY; LOW MELTING; RESOLUTION; RAPID JETTING RATES; LOW MELT FUSING; BROAD FUSING LATITUDE; DEINKING AT PH OF 8-11 XEROX CORPORATION (US) 1996-04-30 US claimed
US-4642132-A HERBICIDES BASF AKTIENGESELLSCHAFT (DE) 1987-02-10 US claimed
US-4196298-A Cyclic sulfonium ylids THE DOW CHEMICAL COMPANY (US) 1980-04-01 US claimed