SCHEMBL6426971

SCHEMBL6426971

O=S(=O)(O)CCCCF.[NaH]

nearest known ligand 0.55

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.55
LMNA P02545 1/20 0.46
SLC6A6 P31641 1/20 0.46
CYP2C19 P33261 1/20 0.46
BLM P54132 1/20 0.46
PTGS1 P23219 1/20 0.39
PDE4A P27815 1/20 0.39
EPHX2 P34913 1/20 0.35
TSHR P16473 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL777191 0.97
SCHEMBL6908004 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL15467103 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL18008343 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL18008808 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
Ammonia Solution, Strong SCHEMBL18008645 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL9164834 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL6426742 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL11476845 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM
SCHEMBL18007769 0.94 APP (0.55) APPLMNASLC6A6CYP2C19BLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4682193-A1 RESIN COMPOSITION FOR FOAM MOLDING, FOAM MOLDED BODY, METHOD FOR PRODUCING FOAM MOLDED BODY, FOAM ELECTRICAL WIRE, AND METHOD FOR PRODUCING FOAM ELECTRICAL WIRE Daikin Industries, Ltd. (JP) 2026-01-21 EP disclosed
EP-4190854-A1 FOAM MOLDING COMPOSITION, FOAMED MOLDED BODY, ELECTRIC WIRE, METHOD FOR MANUFACTURING FOAMED MOLDED BODY, AND METHOD FOR MANUFACTURING ELECTRIC WIRE Daikin Industries, Ltd. (JP) 2023-06-07 EP disclosed
US-20230167258-A1 FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE DAIKIN INDUSTRIES, LTD. (JP) 2023-06-01 US disclosed
CN-116157462-A Composition for foam molding, foam molded body, electric wire, method for producing foam molded body, and method for producing electric wire 大金工业株式会社 2023-05-23 CN disclosed
US-20050147859-A1 proton-conducting polymer membrane has a crosslinked addition-condensation copolymers, containing monomers of a vinyl-containing phosphonic acid, polybenzimidazoles or polysulfones; permselectivity; not permeable to reactive fuels such as hydrogen gas or methanol and gaseous oxygen BASF FUEL CELL GMBH (DE) 2005-07-07 US disclosed