⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL49113 | 0.76 | — | — | |
| SCHEMBL7795737 | 0.75 | — | — | |
| SCHEMBL28906186 | 0.74 | — | — | |
| SCHEMBL28704054 | 0.74 | — | — | |
| SCHEMBL5014857 | 0.73 | — | — | |
| SCHEMBL7759273 | 0.72 | — | — | |
| SCHEMBL29129491 | 0.71 | — | — | |
| SCHEMBL7634598 | 0.71 | — | — | |
| SCHEMBL1537120 | 0.71 | — | — | |
| SCHEMBL486241 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3187555-B1 | MALEIMIDE FILM | FURUKAWA ELECTRIC CO LTD (JP) | 2023-08-23 | — | — | EP | disclosed |
| US-20230095931-A1 | UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS | DESIGNER MOLECULES INC (US) | 2023-03-30 | — | — | US | disclosed |
| EP-4097756-A2 | UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS | Designer Molecules, Inc. (US) | 2022-12-07 | — | — | EP | disclosed |
| WO-2021154898-A2 | UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS | DESIGNER MOLECULES, INC (US) | 2021-08-05 | — | — | WO | disclosed |
| US-20150344627-A1 | LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST | DESIGNER MOLECULES, INC | 2015-12-03 | — | — | US | disclosed |
| WO-2014081894-A1 | LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST | DESIGNER MOLECULES INC (US) | 2014-05-30 | — | — | WO | disclosed |
| EP-1565536-A1 | B-STAGEABLE DIE ATTACH ADHESIVES | Henkel Corporation (US) | 2005-08-24 | — | — | EP | disclosed |
| WO-2004048491-A1 | B-STAGEABLE DIE ATTACH ADHESIVES | HENKEL CORPORATION (US) | 2004-06-10 | — | — | WO | disclosed |
| WO-2004037878-A2 | CO-CURABLE COMPOSITIONS | HENKEL CORPORATION (US) | 2004-05-06 | — | — | WO | disclosed |
| WO-1998014997-A9 | METHOD AND APPARATUS USEFUL FOR THE PREPARATION OF LEAD-ON-CHIP ASSEMBLIES | — | 1998-08-13 | — | — | WO | disclosed |
| WO-1998014997-A1 | METHOD AND APPARATUS USEFUL FOR THE PREPARATION OF LEAD-ON-CHIP ASSEMBLIES | QUANTUM MATERIALS, INC. (US) | 1998-04-09 | — | — | WO | disclosed |