⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride SCHEMBL27860640 | 0.82 | — | — | |
| Fluoride Ion F-18 SCHEMBL12714265 | 0.71 | — | — | |
| Fluoride SCHEMBL9318976 | 0.71 | — | — | |
| Fluoride SCHEMBL3796020 | 0.71 | — | — | |
| Fluoride SCHEMBL32085 | 0.71 | — | — | |
| Fluoride SCHEMBL4543499 | 0.71 | — | — | |
| F-18 SCHEMBL117749 | 0.71 | — | — | |
| Fluoride SCHEMBL49263 | 0.71 | — | — | |
| Fluoride SCHEMBL38465 | 0.71 | — | — | |
| Fluoride SCHEMBL7924055 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1491927-B1 | IC CHIP MOUNTING SUBSTRATE, AND IC CHIP MOUNTING SUBSTRATE MANUFACTURING METHOD | IBIDEN CO LTD (JP) | 2013-02-27 | — | — | EP | disclosed |
| EP-1754986-B1 | Optical communication device and optical communication device manufacturing method | IBIDEN CO LTD (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-8120040-B2 | Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication | IBIDEN CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8076782-B2 | Substrate for mounting IC chip | IBIDEN CO., LTD. (JP) | 2011-12-13 | — | — | US | disclosed |
| US-8078024-B2 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body | IBIDEN CO., LTD. (JP) | 2011-12-13 | — | — | US | disclosed |
| US-7933480-B2 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body | IBIDEN CO., LTD. (JP) | 2011-04-26 | — | — | US | disclosed |
| US-20100232744-A1 | SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING IC CHIP, DEVICE FOR OPTICAL COMMUNICATION, AND MANUFACTURING METHOD OF DEVICE FOR OPTICAL COMMUNICATION | IBIDEN CO., LTD. (JP) | 2010-09-16 | — | — | US | disclosed |
| US-7693382-B2 | Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication | IBIDEN CO., LTD. (JP) | 2010-04-06 | — | — | US | disclosed |
| US-20090285531-A1 | OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE FORMATION METHOD, AND OPTICAL WIRING CONNECTION BODY | IBIDEN, CO., LTD. (JP) | 2009-11-19 | — | — | US | disclosed |
| US-7574085-B2 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body | IBIDEN CO., LTD. (JP) | 2009-08-11 | — | — | US | disclosed |
| US-7418174-B2 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body | IBIDEN CO., LTD. (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20070269164-A1 | OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE FORMATION METHOD, AND OPTICAL WIRING CONNECTION BODY | IBIDEN, CO., LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| US-20070269165-A1 | OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE FORMATION METHOD, AND OPTICAL WIRING CONNECTION BODY | IBIDEN, CO., LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| EP-1754986-A1 | Optical communication device and optical communication device manufacturing method | IBIDEN CO., LTD. (JP) | 2007-02-21 | — | — | EP | disclosed |
| US-7070207-B2 | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication | IBIDEN CO., LTD. (JP) | 2006-07-04 | — | — | US | disclosed |
| US-20060012967-A1 | Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method | IBIDEN CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050185880-A1 | Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication | IBIDEN CO., LTD. (JP) | 2005-08-25 | — | — | US | disclosed |
| US-20050117845-A1 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body | IBIDEN, CO., LTD. (JP) | 2005-06-02 | — | — | US | disclosed |
| EP-1503231-A1 | OPTICAL TRANSMISSION STRUCTURE, OPTICAL GUIDE, METHOD FOR FABRICATING OPTICAL WAVEGUIDE, AND OPTICAL INTERCONNECTION COUPLER | IBIDEN CO., LTD. (JP) | 2005-02-02 | — | — | EP | disclosed |
| US-20040212030-A1 | Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication | IBIDEN CO., LTD. (JP) | 2004-10-28 | — | — | US | disclosed |