SCHEMBL6440337

SCHEMBL6440337

[CH2]CCCCCC(O)CCC

nearest known ligand 0.45

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
FFAR4 Q5NUL3 1/20 0.45
FFAR1 O14842 1/20 0.45
GPR84 Q9NQS5 7/20 0.42
NFKB1 P19838 1/20 0.39
FAAH O00519 2/20 0.37
ACACB O00763 1/20 0.36
ACACA Q13085 1/20 0.36
PSMD14 O00487 2/20 0.36
PLA2G1B P04054 2/20 0.36
MMP2 P08253 2/20 0.36
ATG4B Q9Y4P1 2/20 0.36
HSP90AA1 P07900 1/20 0.36
RAD52 P43351 1/20 0.36
FDPS P14324 3/20 0.35
SPHK1 Q9NYA1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22472165 1.00 FFAR4 (0.45) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL21694363 1.00 FFAR4 (0.45) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL21694360 1.00 FFAR4 (0.45) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL28625567 1.00 FFAR4 (0.45) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL28567240 1.00 FFAR4 (0.45) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL1483481 0.98 FFAR4 (0.42) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL23581561 0.91 FFAR4 (0.50) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL22472169 0.91 FFAR4 (0.50) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL22554803 0.91 FFAR4 (0.50) FFAR4FFAR1GPR84NFKB1FAAH
SCHEMBL21694370 0.91 FFAR4 (0.50) FFAR4FFAR1GPR84NFKB1FAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113825811-B Adhesive composition 住友化学株式会社 2024-01-05 CN disclosed
CN-114502680-B Adhesive composition 住友化学株式会社 2023-12-01 CN disclosed
CN-112566949-B Resin and adhesive composition 住友化学株式会社 2023-06-23 CN disclosed
CN-110249019-B Adhesive composition 住友化学株式会社 2023-05-26 CN disclosed
CN-113474688-B Optical layer and laminate comprising same 住友化学株式会社 2023-05-12 CN disclosed
CN-110799867-B Optical film 住友化学株式会社 2022-09-13 CN disclosed
CN-114867811-A Adhesive composition 住友化学株式会社 2022-08-05 CN disclosed
CN-114846375-A Optical laminate and image display device 住友化学株式会社 2022-08-02 CN disclosed
CN-114846376-A Optical laminate and image display device 住友化学株式会社 2022-08-02 CN disclosed
CN-114846377-A Optical laminate and image display device 住友化学株式会社 2022-08-02 CN disclosed
CN-110799864-A Optical film 住友化学株式会社 2020-02-14 CN disclosed
CN-110799866-A Optical film 住友化学株式会社 2020-02-14 CN disclosed
CN-110651017-A Adhesive composition 住友化学株式会社 2020-01-03 CN disclosed
US-9803161-B2 Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-31 US disclosed
US-20150140820-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-21 US disclosed
EP-2843689-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE Wako Pure Chemical Industries, Ltd. (JP) 2015-03-04 EP disclosed
EP-1172400-B1 THERMOPLASTIC RESIN FILM WITH SATISFACTORY PRINTABILITY YUPO CORP (JP) 2005-12-28 EP disclosed
US-6586106-B2 Ink transfer, adhesion and aging stability, and being satisfactory in back ghost when offset printing using oxidation polymerization type ink is performed on both faces YUPO CORPORATION (JP) 2003-07-01 US disclosed
US-20020054991-A1 Thermoplastic resin film satisfactory in printability YUPO CORPORATION (JP) 2002-05-09 US disclosed
EP-1172400-A1 THERMOPLASTIC RESIN FILM WITH SATISFACTORY PRINTABILITY Yupo Corporation (JP) 2002-01-16 EP disclosed