SCHEMBL647273

SCHEMBL647273

CC(C)COCc1ccc(COCC(C)C)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 5/20 0.44
CA2 P00918 3/20 0.44
TSHR P16473 1/20 0.42
IDO1 P14902 2/20 0.41
CA7 P43166 2/20 0.41
CA9 Q16790 2/20 0.41
HTT P42858 3/20 0.40
HPGD P15428 1/20 0.40
KMT2A Q03164 2/20 0.40
TACR1 P25103 4/20 0.39
RAB9A P51151 2/20 0.38
USP2 O75604 1/20 0.38
GAA P10253 1/20 0.38
MAPK1 P28482 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
KDM4E B2RXH2 1/20 0.38
NPC1 O15118 1/20 0.38
MAPT P10636 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19638063 0.93 CA1 (0.41) CA1CA2TSHRIDO1CA7
SCHEMBL8263617 0.91 AGXT (0.50) CA1CA2IDO1CA9HTT
SCHEMBL18092253 0.91 PTGS1 (0.41) CA1CA2TSHR
SCHEMBL8301664 0.91 TAAR1 (0.47) CA1CA2IDO1CA7CA9
SCHEMBL12153202 0.89 HTT (0.53) CA1CA2TSHRIDO1CA9
SCHEMBL13676863 0.89 IDO1 (0.48) CA1CA2IDO1HPGD
SCHEMBL2234953 0.88 TSHR (0.61) CA1CA2TSHRIDO1CA7
SCHEMBL24067996 0.87 CA1 (0.41) CA1CA2IDO1CA7CA9
SCHEMBL2608864 0.87 CA1 (0.62) CA1CA2IDO1L3MBTL1
Ammonia Solution, Strong SCHEMBL21518144 0.86 TSHR (0.58) CA1CA2TSHRCA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
US-20140332984-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2014-11-13 US disclosed
US-8200059-B2 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-12 US disclosed
US-20120080808-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI (JP) 2012-04-05 US disclosed
US-8119737-B2 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-20110187006-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-08-04 US disclosed
US-7947779-B2 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-05-24 US disclosed
US-20110021005-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-01-27 US disclosed
EP-0233450-B1 LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-03-11 EP disclosed
EP-0471522-A1 Resin composition based on polymaleimide and phenolic aralkyl resin MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-02-19 EP disclosed
US-4966961-A REACTING AROMATIC AMINE/POLYAMINE WITH MALEIC ANHYDRIDE; HEAT RESISTANCE COMPOSITES, THERMOSETTING RESINS MITSUI TOATSU CHEMICALS, INC. (JP) 1990-10-30 US disclosed
US-4959443-A HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-25 US disclosed
US-4937318-A Aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1990-06-26 US disclosed
EP-0342989-A2 Polymaleimide compounds and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0311387-A2 Aromatic amine resins, their production process and thermosetting resin compositions making use of the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-04-12 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed