SCHEMBL647577

SCHEMBL647577

CCC(OC(C)C)(C(=O)O)C(=O)C(OC(C)C)OC(C)C.[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1262079 0.96
SCHEMBL649038 0.96
SCHEMBL647574 0.81
SCHEMBL6537024 0.81
SCHEMBL4294305 0.81
SCHEMBL4623694 0.81
SCHEMBL155223 0.81
SCHEMBL1263872 0.78
SCHEMBL8618233 0.76
SCHEMBL27551333 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240231230-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-07-11 US disclosed
US-11609499-B2 Silicon-containing coating agent for pattern reversal NISSAN CHEMICAL CORPORATION (JP) 2023-03-21 US disclosed
US-11392037-B2 Resist underlayer film forming composition containing silicone having cyclic amino group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2022-07-19 US disclosed
US-20220177653-A1 FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-06-09 US disclosed
US-10910220-B2 Planarization method for a semiconductor substrate using a silicon-containing composition NISSAN CHEMICAL CORPORATION (JP) 2021-02-02 US disclosed
US-10845703-B2 Film-forming composition containing silicone having crosslinking reactivity NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-11-24 US disclosed
US-20190339618-A1 SILICON-CONTAINING COATING AGENT FOR PATTERN REVERSAL NISSAN CHEMICAL CORPORATION (JP) 2019-11-07 US disclosed
US-20190292403-A1 COATING COMPOSITION FOR PATTERN INVERSION NISSAN CHEMICAL CORPORATION (JP) 2019-09-26 US disclosed
US-10372039-B2 Resist underlayer film forming composition containing silicon having ester group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2019-08-06 US disclosed
US-20190051518-A1 PLANARIZATION METHOD FOR A SEMICONDUCTOR SUBSTRATE USING A SILICON-CONTAINING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2019-02-14 US disclosed
US-6828078-B2 Photoresist for use in optoelectronic and display fields; porosity; optical fibers JSR CORPORATION (JP) 2004-12-07 US disclosed
US-6824833-B2 STACKED DIELECTRIC JSR CORPORATION (JP) 2004-11-30 US disclosed
US-6787289-B2 OPTICS JSR CORPORATION (JP) 2004-09-07 US disclosed
US-20040013972-A1 Radiation-sensitive composition changing in refractive index and method of changing refractive index JSR CORPORATION (JP) 2004-01-22 US disclosed
US-20040005506-A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern JSR CORPORATION (JP) 2004-01-08 US disclosed
US-6576393-B1 Hydrolysate and/or a condensate of a siloxane compound; compound generating an acid by ultraviolet irradiation and/or heating; adhesion, resistance to a developing solution, decrease in film loss in oxygen ashing of the resist JSR CORPORATION (JP) 2003-06-10 US disclosed
US-20030077461-A1 Stacked film, insulating film and substrate for semiconductor JSR CORPORATION (JP) 2003-04-24 US disclosed
US-6465368-B2 DISSOLVING POLYMER IN SOLVENT; FORMING DIELECTRIC FILMS JSR CORPORATION (JP) 2002-10-15 US disclosed
US-6406794-B1 POLYETHERSILOXANE COPOLYMER JSR CORPORATION (JP) 2002-06-18 US disclosed
US-20010051446-A1 Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film JSR CORPORATION (JP) 2001-12-13 US disclosed