SCHEMBL64817

SCHEMBL64817

FB(F)F.[N]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27495583 0.89
SCHEMBL29940263 0.89
SCHEMBL780 0.89
Phosphine SCHEMBL63647 0.80
Lithium SCHEMBL838176 0.80
SCHEMBL1493171 0.80
SCHEMBL8778140 0.80
SCHEMBL8407772 0.80
SCHEMBL20488766 0.80
Hydrogen Sulfide SCHEMBL21987862 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 5521 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12043734-B2 Sheet-form insulating varnish and producing method therefor, electrical device, and rotary electric machine MITSUBISHI ELECTRIC CORPORATION (JP) 2024-07-23 US claimed
US-20240228719-A1 EPOXY BASED REINFORCING PATCHES HAVING IMPROVED DAMPING LOSS FACTOR UNISEAL, INC. 2024-07-11 US claimed
EP-4396249-A1 TWO-COMPONENT STRUCTURAL ADHESIVE DDP Specialty Electronic Materials US, LLC (US) 2024-07-10 EP claimed
CN-112175565-B Moisture-curable resin composition and cured product 三键有限公司 2024-07-02 CN claimed
CN-118272019-A Conductive silver adhesive, preparation method and application thereof and power device 北京中科纳通电子技术有限公司 2024-07-02 CN claimed
CN-113969122-B Low-dielectric thermosetting adhesive composition, preparation method thereof and flexible copper-clad plate 华烁科技股份有限公司 2024-06-18 CN claimed
CN-118185020-A Fluorine-containing silicon resin and preparation method and application thereof 东莞泰岳先进材料有限公司 2024-06-14 CN claimed
CN-118055962-A Epoxy curing agent composition comprising naphthol and naphthol derivative 赢创运营有限公司 2024-05-17 CN claimed
CN-118048020-A Acid thermosensitive resin and precoated resin copper foil 珠海市能动科技光学产业有限公司 2024-05-17 CN claimed
CN-118027608-A Controllably degradable epoxy resin-based composite insulating material and preparation method and application thereof 中国科学院宁波材料技术与工程研究所 2024-05-14 CN claimed
EP-0031904-B1 HEAT-RESISTANT THERMOSETTING RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1984-05-16 EP claimed
US-4436880-A OXIDANT PROMOTER CIBA-GEIGY CORPORATION (US) 1984-03-13 US claimed
US-4309512-A MALEIMIDE COMPOUND MODIFIED WITH FURFURYL ACLOHOL, EPOXY RESIN, POLYVINYL FORMAL AND CURING AGENT; DIELECTRIC COATINGS TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1982-01-05 US claimed
EP-0042177-A1 Stabilizers for cycloaliphatic epoxide containing compositions UNION CARBIDE CORPORATION (US) 1981-12-23 EP claimed
US-4294746-A NITRILES OR ISOCYANATES FOR MOLDED ARTICLES UNION CARBIDE CORPORATION (US) 1981-10-13 US claimed
US-4292396-A Method for improving the press life of a lithographic image having an outer layer comprising an epoxy resin and article produced by method WESTERN LITHO PLATE & SUPPLY CO. (US) 1981-09-29 US claimed
EP-0031904-A1 Heat-resistant thermosetting resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1981-07-15 EP claimed
US-4267379-A OBTAINING PHENOL AND ACETONE; DEACTIVATION OF THE BORON TRIFLUORIDE OR COMPLEX, E.G. SOLVATES, WITH AN AMINE; DISTILLATION; DISSOCIATION; CIRCULATION GULF RESEARCH & DEVELOPMENT COMPANY (US) 1981-05-12 US claimed
US-4247594-A CURING A MIXTURE OF COPPER FLAKES, THE DIGLYCIDYL ETHER OF BISPHENOL A, AND A CURING AGENT AND THEN APPLYING AN ELECTRICAL POTENTIAL MARSHALL & PIKE ENTERPRISES INC. (US) 1981-01-27 US claimed
US-4025348-A DI-UNSATURATED COMPOUND, POLYMER WITH TETRAHYDROFURFURYL OR N-ALKOXYMETHYLCARBAMOYL GROUPS, DIEPOXIDE, SENSITIZER, CURING AGENT HITACHI CHEMICAL COMPANY, LTD. (JA) 1977-05-24 US claimed