⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1501827 | 0.88 | — | — | |
| SCHEMBL3229477 | 0.88 | — | — | |
| Ethane SCHEMBL5851586 | 0.86 | — | — | |
| SCHEMBL6065835 | 0.86 | — | — | |
| SCHEMBL11183068 | 0.86 | — | — | |
| SCHEMBL22129636 | 0.86 | — | — | |
| SCHEMBL81839 | 0.86 | — | — | |
| SCHEMBL36991 | 0.86 | — | — | |
| SCHEMBL446304 | 0.83 | — | — | |
| SCHEMBL27260190 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8816485-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-08-26 | — | — | US | claimed |
| US-9263416-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-02-16 | — | — | US | disclosed |
| US-20140349446-A1 | METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING | PROMERUS, LLC (US) | 2014-11-27 | — | — | US | disclosed |
| US-8816485-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-08-26 | — | — | US | disclosed |
| US-20120175721-A1 | Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding | PROMERUS LLC (US) | 2012-07-12 | — | — | US | disclosed |
| US-8120168-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2012-02-21 | — | — | US | disclosed |
| CN-102298265-A | Photosensitive compositions based on polycyclic polymers | — | 2011-12-28 | — | — | CN | disclosed |
| EP-1997138-B1 | METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING | PROMERUS LLC (US) | 2011-09-14 | — | — | EP | disclosed |
| US-7932161-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2011-04-26 | — | — | US | disclosed |
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-20080073741-A1 | provide strong bonds while also being readily removed with little or no residues; reworkable; semiconductor; norbornene-type polymer derived from phenethyl norbornene, or glycidyl methyl ether norbornene or decyl norbornene | PROMERUS LLC (US) | 2008-03-27 | — | — | US | disclosed |
| US-20070232026-A1 | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2007-10-04 | — | — | US | disclosed |
| WO-2007109326-A2 | METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING | PROMERUS LLC (US) | 2007-09-27 | — | — | WO | disclosed |
| CN-101044185-A | Photosensitive compositions based on polycyclic polymers | PROMERUS LLC (US) | 2007-09-26 | — | — | CN | disclosed |
| EP-1804291-A1 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1801872-A1 | SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1771491-A1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS | Promerus, LLC (US) | 2007-04-11 | — | — | EP | disclosed |
| WO-2006016925-A1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS | PROMERUS LLC (US) | 2006-02-16 | — | — | WO | disclosed |
| US-20060020068-A1 | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films | PROMERUS, LLC | 2006-01-26 | — | — | US | disclosed |
| CN-1666150-A | Photosensitive composition based on polycyclic polymer | SUMITOMO BAKELITE CO (JP) | 2005-09-07 | — | — | CN | disclosed |