SCHEMBL649428

SCHEMBL649428

CC(=O)N([C]=O)C(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8039850 0.74
SCHEMBL9550363 0.69
SCHEMBL733425 0.69
SCHEMBL5635905 0.69
SCHEMBL6970371 0.67
SCHEMBL945094 0.67
SCHEMBL2264884 0.67
Carbon Dioxide SCHEMBL7568877 0.67
Acetone SCHEMBL890603 0.62
SCHEMBL22163812 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109709770-B Resin composition, dry film and method for producing same, method for producing resist film and substrate, method for producing plated molded article, and mercapto compound 东京应化工业株式会社 2023-11-24 CN disclosed
US-11061326-B2 Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-07-13 US disclosed
US-11022880-B2 Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-06-01 US disclosed
US-20200209739-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2020-07-02 US disclosed
US-20190121233-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND MERCAPTO COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2019-04-25 US disclosed
US-20190101825-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, A PHOTOSENSITIVE DRY FILM, A METHOD FOR PRODUCING A PHOTOSENSITIVE DRY FILM, A METHOD FOR PRODUCING A PATTERNED RESIST FILM, A METHOD OF MANUFACTURING A TEMPLATE WITH A SUBSTRATE, AND A METHOD OF MANUFACTURING A PLATED SHAPED PRODUCT, AND A MERCAPTO COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2019-04-04 US disclosed
US-20180259853-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD FOR MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-09-13 US disclosed
US-8119686-B2 Spiroquinone compound and pharmaceutical composition HYKES LABORATORIES LLC (JP) 2012-02-21 US disclosed
US-20100056613-A1 SPIROQUINONE COMPOUND AND PHARMACEUTICAL COMPOSITION HYKES LABORATORIES LLC (JP) 2010-03-04 US disclosed
EP-2070919-A1 SPIROQUINONE COMPOUND AND PHARMACEUTICAL COMPOSITION Hykes Laboratories LLC (JP) 2009-06-17 EP disclosed