SCHEMBL649429

SCHEMBL649429

CC(=O)N(C=O)C(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18118930 0.73 TSHR (0.35)
SCHEMBL28512411 0.71
SCHEMBL10725040 0.71
SCHEMBL1398272 0.69
Dimethylformamide SCHEMBL57861 0.69 TSHR (0.60)
SCHEMBL2154488 0.69
SCHEMBL733426 0.69
SCHEMBL11430371 0.67
SCHEMBL11423968 0.67
SCHEMBL4105321 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120302487-A1 COMPOSITE REVOLYMER LIMITED (GB) 2012-11-29 US claimed
EP-2494024-A1 COMPOSITE Revolymer Limited (GB) 2012-09-05 EP claimed
WO-2011051681-A1 COMPOSITE REVOLYMER LIMITED (GB) 2011-05-05 WO claimed
US-20080176943-A1 One part, solids containing decontamination blend composition AMERICAN STERILIZER COMPANY 2008-07-24 US claimed
CN-117143853-A Preparation method of artificial cell model for self-synthesis of uridine monophosphate 哈尔滨工业大学 2023-12-01 CN disclosed
CN-114634420-A Method for continuously preparing methylglycine-N, N-diacetic acid trialkali metal salt 万华化学集团股份有限公司 2022-06-17 CN disclosed
US-11061326-B2 Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-07-13 US disclosed
US-11022880-B2 Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-06-01 US disclosed
US-10752783-B2 Non-stick coating primer compositions and processes for the preparation thereof SEB S.A. (FR) 2020-08-25 US disclosed
US-20200209739-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2020-07-02 US disclosed
EP-2393354-B1 LOW ODOR, HARD SURFACE SPORICIDES AND CHEMICAL DECONTAMINANTS AMERICAN STERILIZER CO (US) 2019-08-21 EP disclosed
US-20190121233-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND MERCAPTO COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2019-04-25 US disclosed
US-20100196505-A1 Low odor, hard surface sporicides and chemical decontaminants AMERICAN STERILIZER COMPANY (US) 2010-08-05 US disclosed
US-20100056613-A1 SPIROQUINONE COMPOUND AND PHARMACEUTICAL COMPOSITION HYKES LABORATORIES LLC (JP) 2010-03-04 US disclosed
EP-2070919-A1 SPIROQUINONE COMPOUND AND PHARMACEUTICAL COMPOSITION Hykes Laboratories LLC (JP) 2009-06-17 EP disclosed
EP-2059581-A2 A ONE PART, SOLIDS CONTAINING DECONTAMINATION BLEND COMPOSITION American Sterilizer Company (US) 2009-05-20 EP disclosed
US-20080176943-A1 One part, solids containing decontamination blend composition AMERICAN STERILIZER COMPANY 2008-07-24 US disclosed
WO-2008079170-A2 A ONE PART, SOLIDS CONTAINING DECONTAMINATION BLEND COMPOSITION AMERICAN STERILIZER COMPANY (US) 2008-07-03 WO disclosed
US-4833204-A Epoxy resin composition for a copper-clad laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-05-23 US disclosed
US-4018756-A ACRYLONITRILE POLYMERS, POLYAMIDES, POLYESTERS SUMITOMO CHEMICAL COMPANY, LIMITED (JA) 1977-04-19 US disclosed