⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22551531 | 0.96 | — | — | |
| SCHEMBL22551509 | 0.96 | — | — | |
| SCHEMBL7108269 | 0.84 | — | — | |
| SCHEMBL7101834 | 0.84 | — | — | |
| SCHEMBL653280 | 0.83 | — | — | |
| SCHEMBL22551443 | 0.82 | — | — | |
| SCHEMBL22551426 | 0.81 | — | — | |
| SCHEMBL23142641 | 0.81 | — | — | |
| SCHEMBL4356589 | 0.78 | — | — | |
| SCHEMBL22551453 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8119758-B2 | Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20080057325-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070293624-A1 | HEAT CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070290202-A1 | ORGANOSILICON COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| EP-1867652-A1 | Organosilicon compound | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-12-19 | — | — | EP | disclosed |