⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25532074 | 0.85 | — | — | |
| SCHEMBL15705448 | 0.85 | — | — | |
| SCHEMBL7101843 | 0.84 | — | — | |
| SCHEMBL7108270 | 0.84 | — | — | |
| SCHEMBL7108257 | 0.84 | — | — | |
| SCHEMBL580589 | 0.83 | — | — | |
| SCHEMBL30227801 | 0.82 | — | — | |
| SCHEMBL16769775 | 0.81 | — | — | |
| SCHEMBL23142642 | 0.81 | — | — | |
| SCHEMBL30671938 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4698584-A1 | METHOD FOR PREPARING SILANOL-FUNCTIONAL ORGANOSILICON COMPOUNDS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2026-02-25 | — | — | EP | disclosed |
| EP-4683961-A1 | ALKOXY-FUNCTIONAL SILSESQUIOXANE RESIN AND PROCESSES FOR THE PREPARATION AND USE THEREOF | DOW GLOBAL TECHNOLOGIES LLC (US) | 2026-01-28 | — | — | EP | disclosed |
| EP-4683960-A1 | EMULSION OF ALKOXY-FUNCTIONAL SILSESQUIOXANE RESIN AND PROCESSES FOR THE PREPARATION AND USE THEREOF | Dow Silicones Corporation (US) | 2026-01-28 | — | — | EP | disclosed |
| WO-2024220168-A1 | METHOD FOR PREPARING SILANOL-FUNCTIONAL ORGANOSILICON COMPOUNDS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-10-24 | — | — | WO | disclosed |
| WO-2024196439-A1 | ALKOXY-FUNCTIONAL SILSESQUIOXANE RESIN AND PROCESSES FOR THE PREPARATION AND USE THEREOF | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-09-26 | — | — | WO | disclosed |
| WO-2024196440-A1 | EMULSION OF ALKOXY-FUNCTIONAL SILSESQUIOXANE RESIN AND PROCESSES FOR THE PREPARATION AND USE THEREOF | DOW SILICONES CORPORATION (US) | 2024-09-26 | — | — | WO | disclosed |
| US-8119758-B2 | Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8119758-B2 | Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20080057325-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20080057325-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070293624-A1 | HEAT CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070293624-A1 | HEAT CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070290202-A1 | ORGANOSILICON COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070290202-A1 | ORGANOSILICON COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| EP-1867652-A1 | Organosilicon compound | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-12-19 | — | — | EP | disclosed |